SWRS170K March   2014  – November 2023 WL1807MOD , WL1837MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
    1. 6.1 Related Products
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Attributes
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  External Digital Slow Clock Requirements
    5. 8.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 8.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 8.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 8.8  WLAN Performance: 5-GHz Receiver Characteristics
    9. 8.9  WLAN Performance: 5-GHz Transmitter Power
    10. 8.10 WLAN Performance: Currents
    11. 8.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 8.12 Bluetooth Performance: Transmitter, BR
    13. 8.13 Bluetooth Performance: Transmitter, EDR
    14. 8.14 Bluetooth Performance: Modulation, BR
    15. 8.15 Bluetooth Performance: Modulation, EDR
    16. 8.16 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals
    17. 8.17 Bluetooth low energy Performance: Transmitter Characteristics
    18. 8.18 Bluetooth low energy Performance: Modulation Characteristics
    19. 8.19 Bluetooth BR and EDR Dynamic Currents
    20. 8.20 Bluetooth low energy Currents
    21. 8.21 Timing and Switching Characteristics
      1. 8.21.1 Power Management
        1. 8.21.1.1 Block Diagram – Internal DC-DCs
      2. 8.21.2 Power-Up and Shut-Down States
      3. 8.21.3 Chip Top-level Power-Up Sequence
      4. 8.21.4 WLAN Power-Up Sequence
      5. 8.21.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 8.21.6 WLAN SDIO Transport Layer
        1. 8.21.6.1 SDIO Timing Specifications
        2. 8.21.6.2 SDIO Switching Characteristics – High Rate
      7. 8.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 8.21.7.1 UART 4-Wire Interface – H4
      8. 8.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  10. 9 Detailed Description
    1. 9.1 WLAN Features
    2. 9.2 Bluetooth Features
    3. 9.3 Bluetooth Low Energy Features
    4. 9.4 Device Certification
      1. 9.4.1 FCC Certification and Statement
      2. 9.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 9.4.3 ETSI/CE
      4. 9.4.4 MIC Certification
    5. 9.5 Module Markings
    6. 9.6 Test Grades
    7. 9.7 End Product Labeling
    8. 9.8 Manual Information to the End User
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application – WL1837MOD Reference Design
      2. 10.1.2 Design Recommendations
      3. 10.1.3 RF Trace and Antenna Layout Recommendations
      4. 10.1.4 Module Layout Recommendations
      5. 10.1.5 Thermal Board Recommendations
      6. 10.1.6 Baking and SMT Recommendations
        1. 10.1.6.1 Baking Recommendations
        2. 10.1.6.2 SMT Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Tools and Software
      3. 11.1.3 Device Support Nomenclature
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.1 Typical Application – WL1837MOD Reference Design

Figure 10-1 shows the TI WL1837MODGI reference design.

GUID-A398A3FC-A250-43CE-97F3-D4A63B69A262-low.gif Figure 10-1 TI Module Reference Schematics

Table 10-1 lists the bill materials (BOM).

Table 10-1 Bill of Materials
ITEM DESCRIPTION PART NO. PACKAGE REFERENCE QTY MFR
1 WL1837 Wi-Fi / Bluetooth module WL1837MODGI 13.4 × 13.3 × 2.0 mm U1 1 TI
2 XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm 7XZ3200005 3.2 × 2.5 × 1.0 mm OSC1 1 TXC
3 ANT / Chip / 2.4 GHz and 5 GHz(1) W3006 10.0 × 3.2 × 1.5 mm ANT1, ANT2 2 Pulse
4 Mini-RF header receptacle U.FL-R-SMT-1 (10) 3.0 × 2.6 × 1.25 mm J5, J6 2 Hirose
5 Inductor 0402 / 1.3 nH / ±0.1 nH / SMD LQP15MN1N3B02 0402 L1 1 Murata
6 Inductor 0402 / 1.8 nH / ±0.1 nH / SMD LQP15MN1N8B02 0402 L3 1 Murata
7 Inductor 0402 / 2.2 nH / ±0.1 nH / SMD LQP15MN2N2B02 0402 L4 1 Murata
8 Capacitor 0402 / 1 pF/ 50 V / C0G / ±0.1 pF GJM1555C1H1R0BB01 0402 C13 1 Murata
9 Capacitor 0402 / 2.4 pF / 50 V / C0G / ±0.1 pF GJM1555C1H2R4BB01 0402 C14 1 Murata
10 Capacitor 0402 / 0.1 µF / 10 V / X7R / ±10% 0402B104K100CT 0402 C3 1 Walsin
11 Capacitor 0402 / 1 µF / 6.3 V / X5R / ±10%/HF GRM155R60J105KE19D 0402 C1 1 Murata
12 Capacitor 0603 / 10 µF / 6.3 V / X5R / ±20% C1608X5R0J106M 0603 C2 1 TDK
13 Resistor 0402 / 0R / ±5% WR04X000 PTL 0402 R1, R3 2 Walsin
(1) For more information, see the Pulse Electronics W3006 product page.