SWRS170L March   2014  – May 2025 WL1807MOD , WL1837MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Attributes
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  External Digital Slow Clock Requirements
    5. 7.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 7.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 7.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 7.8  WLAN Performance: 5GHz Receiver Characteristics
    9. 7.9  WLAN Performance: 5GHz Transmitter Power
    10. 7.10 WLAN Performance: Currents
    11. 7.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 7.12 Bluetooth Performance: Transmitter, BR
    13. 7.13 Bluetooth Performance: Transmitter, EDR
    14. 7.14 Bluetooth Performance: Modulation, BR
    15. 7.15 Bluetooth Performance: Modulation, EDR
    16. 7.16 Bluetooth Low Energy Performance: Receiver Characteristics – In-Band Signals
    17. 7.17 Bluetooth Low Energy Performance: Transmitter Characteristics
    18. 7.18 Bluetooth Low Energy Performance: Modulation Characteristics
    19. 7.19 Bluetooth BR and EDR Dynamic Currents
    20. 7.20 Bluetooth Low Energy Currents
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Power Management
        1. 7.21.1.1 Block Diagram – Internal DC-DCs
      2. 7.21.2 Power-Up and SHUTDOWN States
      3. 7.21.3 Chip Top-level Power-Up Sequence
      4. 7.21.4 WLAN Power-Up Sequence
      5. 7.21.5 Bluetooth-Bluetooth Low Energy Power-Up Sequence
      6. 7.21.6 WLAN SDIO Transport Layer
        1. 7.21.6.1 SDIO Timing Specifications
        2. 7.21.6.2 SDIO Switching Characteristics – High Rate
      7. 7.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 7.21.7.1 UART 4-Wire Interface – H4
      8. 7.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 8 Detailed Description
    1. 8.1 WLAN Features
    2. 8.2 Bluetooth Features
    3. 8.3 Bluetooth Low Energy Features
    4. 8.4 Device Certification
      1. 8.4.1 FCC Certification and Statement
      2. 8.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 8.4.3 ETSI/CE
      4. 8.4.4 MIC Certification
    5. 8.5 Module Markings
    6. 8.6 Test Grades
    7. 8.7 End Product Labeling
    8. 8.8 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application – WL1837MOD Reference Design
      2. 9.1.2 Design Recommendations
      3. 9.1.3 RF Trace and Antenna Layout Recommendations
      4. 9.1.4 Module Layout Recommendations
      5. 9.1.5 Thermal Board Recommendations
      6. 9.1.6 Baking and SMT Recommendations
        1. 9.1.6.1 Baking Recommendations
        2. 9.1.6.2 SMT Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Tools and Software
      3. 10.1.3 Device Support Nomenclature
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 WLAN Performance: 2.4GHz Transmitter Power

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.
PARAMETERCONDITION(1)MIN TYPMAXUNIT
RF_ANT1 Pin 2.4GHz SISO
Output Power: Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM(2)1 Mbps DSSS17.3dBm
2 Mbps DSSS17.3
5.5 Mbps CCK17.3
11 Mbps CCK17.3
6 Mbps OFDM17.1
9 Mbps OFDM17.1
12 Mbps OFDM17.1
18 Mbps OFDM17.1
24 Mbps OFDM16.2
36 Mbps OFDM15.3
48 Mbps OFDM14.6
54 Mbps OFDM13.8
MCS0 MM16.1
MCS1 MM16.1
MCS2 MM16.1
MCS3 MM16.1
MCS4 MM15.3
MCS5 MM14.6
MCS6 MM13.8
MCS7 MM(3)12.6
MCS0 MM 40 MHz14.8
MCS7 MM 40 MHz11.3
RF_ANT1 + RF_ANT2 MIMO
MCS12 (WL18x5)18.5dBm
MCS13 (WL18x5)17.4
MCS14 (WL18x5)14.5
MCS15 (WL18x5)13.4
RF_ANT1 + RF_ANT2
Operation frequency range24122484MHz
Return loss–10.0dB
Reference input impedance50.0Ω
(1) Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80°C ambient temperature on MIMO operation
(2) Regulatory constraints limit TI module output power to the following:
  • Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm.
  • Channels 1, 11 at OFDM legacy and HT 20-MHz rates: 12 dBm
  • Channels 1, 11 at HT 40-MHz rates: 10 dBm
  • Channel 7 at HT 40-MHz lower rates: 10 dBm
  • Channel 5 at HT 40-MHz upper rates: 10 dBm
  • All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit.
  • All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit.
  • For clarification regarding power limitation, see the WL18xx .INI File Application Report.
(3) To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11™ – 2012:
  • MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value.
  • MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value.