SWRS170L March   2014  – May 2025 WL1807MOD , WL1837MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Attributes
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  External Digital Slow Clock Requirements
    5. 7.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 7.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 7.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 7.8  WLAN Performance: 5GHz Receiver Characteristics
    9. 7.9  WLAN Performance: 5GHz Transmitter Power
    10. 7.10 WLAN Performance: Currents
    11. 7.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 7.12 Bluetooth Performance: Transmitter, BR
    13. 7.13 Bluetooth Performance: Transmitter, EDR
    14. 7.14 Bluetooth Performance: Modulation, BR
    15. 7.15 Bluetooth Performance: Modulation, EDR
    16. 7.16 Bluetooth Low Energy Performance: Receiver Characteristics – In-Band Signals
    17. 7.17 Bluetooth Low Energy Performance: Transmitter Characteristics
    18. 7.18 Bluetooth Low Energy Performance: Modulation Characteristics
    19. 7.19 Bluetooth BR and EDR Dynamic Currents
    20. 7.20 Bluetooth Low Energy Currents
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Power Management
        1. 7.21.1.1 Block Diagram – Internal DC-DCs
      2. 7.21.2 Power-Up and SHUTDOWN States
      3. 7.21.3 Chip Top-level Power-Up Sequence
      4. 7.21.4 WLAN Power-Up Sequence
      5. 7.21.5 Bluetooth-Bluetooth Low Energy Power-Up Sequence
      6. 7.21.6 WLAN SDIO Transport Layer
        1. 7.21.6.1 SDIO Timing Specifications
        2. 7.21.6.2 SDIO Switching Characteristics – High Rate
      7. 7.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 7.21.7.1 UART 4-Wire Interface – H4
      8. 7.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 8 Detailed Description
    1. 8.1 WLAN Features
    2. 8.2 Bluetooth Features
    3. 8.3 Bluetooth Low Energy Features
    4. 8.4 Device Certification
      1. 8.4.1 FCC Certification and Statement
      2. 8.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 8.4.3 ETSI/CE
      4. 8.4.4 MIC Certification
    5. 8.5 Module Markings
    6. 8.6 Test Grades
    7. 8.7 End Product Labeling
    8. 8.8 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application – WL1837MOD Reference Design
      2. 9.1.2 Design Recommendations
      3. 9.1.3 RF Trace and Antenna Layout Recommendations
      4. 9.1.4 Module Layout Recommendations
      5. 9.1.5 Thermal Board Recommendations
      6. 9.1.6 Baking and SMT Recommendations
        1. 9.1.6.1 Baking Recommendations
        2. 9.1.6.2 SMT Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Tools and Software
      3. 10.1.3 Device Support Nomenclature
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Pin Attributes

Table 6-1 describes the module pins.

Table 6-1 Pin Attributes
PIN NAMEPIN NO.TYPE/DIRSHUTDOWN STATE(1)AFTER POWER UP(1)VOLTAGE LEVELCONNECTIVITY(2)DESCRIPTION(3)
18071837
Clocks and Reset Signals
WL_SDIO_CLK_1V88IHi-ZHi-Z1.8VvvWLAN SDIO clock. Must be driven by the host.
EXT_32K36ANA–vvInput sleep clock:
32.768 kHz
WLAN_EN40IPDPD1.8VvvMode setting: high = enable
BT_EN41IPDPD1.8VxvMode setting: high = enable. If Bluetooth is not used, connect to ground.
Power-Management Signals
VIO_IN38POWPDPD1.8VvvConnect to 1.8V external VIO
VBAT_IN46POWVBATvvPower supply input, 2.9 to 4.8V
VBAT_IN47POWVBATvvPower supply input, 2.9 to 4.8V
TI Reserved
GPIO112I/OPDPD1.8VvvReserved for future use. NC if not used.
GPIO93I/OPDPD1.8VvvReserved for future use. NC if not used.
GPIO104I/OPUPU1.8VvvReserved for future use. NC if not used.
GPIO125I/OPUPU1.8VvvReserved for future use. NC if not used.
RESERVED121IPDPD1.8VxxReserved for future use. NC if not used.
RESERVED222IPDPD1.8VxxReserved for future use. NC if not used.
GPIO425I/OPDPD1.8VvvReserved for future use. NC if not used.
RESERVED362OPDPD1.8VxxReserved for future use. NC if not used. Option: External TCXO.
WLAN Functional Block: Int Signals
WL_SDIO_CMD_1V86I/OHi-ZHi-Z1.8VvvWLAN SDIO command
WL_SDIO_D0_1V810I/OHi-ZHi-Z1.8VvvWLAN SDIO data bit 0
WL_SDIO_D1_1V811I/OHi-ZHi-Z1.8VvvWLAN SDIO data bit 1
WL_SDIO_D2_1V812I/OHi-ZHi-Z1.8VvvWLAN SDIO data bit 2
WL_SDIO_D3_1V813I/OHi-ZPU1.8VvvWLAN SDIO data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization.
WL_IRQ_1V814OPD01.8VvvSDIO available, interrupt out. Active high. (For WL_RS232_TX/RX pullup is at power up.) Set to rising edge (active high) on power up. The Wi-Fi interrupt line can be configured by the driver according to the IRQ configuration (polarity/level/edge).
RF_ANT218ANA–vv5G ANT diversity TX/RX , 2.4G Secondary antenna MRC/MIMO only
GPIO226I/OPDPD1.8VvvWL_RS232_RX (when WLAN_IRQ = 1 at power up)
GPIO127I/OPDPD1.8VvvWL_RS232_TX (when WLAN_IRQ = 1 at power up)
RF_ANT132ANA–vv5G main ANT TX/RX, 2.4G WLAN main antenna SISO, Bluetooth
WL_UART_DBG42OPUPU1.8VvvOption: WLAN logger
Bluetooth Functional Block: Int Signals
BT_UART_DBG43OPUPU1.8VxvOption: Bluetooth logger
BT_HCI_RTS_1V850OPUPU1.8VxvUART RTS to host. NC if not used.
BT_HCI_CTS_1V851IPUPU1.8VxvUART CTS from host. NC if not used.
BT_HCI_TX_1V852OPUPU1.8VxvUART TX to host. NC if not used.
BT_HCI_RX_1V853IPUPU1.8VxvUART RX from host. NC if not used.
BT_AUD_IN56IPDPD1.8VxvBluetooth PCM/I2S bus. Data in. NC if not used.
BT_AUD_OUT57OPDPD1.8VxvBluetooth PCM/I2S bus. Data out. NC if not used.
BT_AUD_FSYNC58I/OPDPD1.8VxvBluetooth PCM/I2S bus. Frame sync. NC if not used.
BT_AUD_CLK60I/OPDPD1.8VxvBluetooth PCM/I2S bus. NC if not used.
Ground Pins
GND1GND–vvv
GND7GND–vvv
GND9GND–vvv
GND15GND–vvv
GND16GND–vvv
GND17GND–vvv
GND19GND–vvv
GND20GND–vvv
GND23GND–vvv
GND24GND–vvv
GND28GND–vvv
GND29GND–vvv
GND30GND–vvv
GND31GND–vvv
GND33GND–vvv
GND34GND–vvv
GND35GND–vvv
GND37GND–vvv
GND39GND–vvv
GND44GND–vvv
GND45GND–vvv
GND48GND–vvv
GND49GND–vvv
GND54GND–vvv
GND55GND–vvv
GND59GND–vvv
GND61GND–vvv
GND63GND–vvv
GNDG1 – G36GND–vvv
GND64GND–vvv
(1) PU = pullup; PD = pulldown; Hi-Z = high-impedance
(2) v = connect; x = no connect.
(3) Host must provide PU using a 10kΩ resistor for all non-CLK SDIO signals.