SWRS152N June   2013  – April 2021 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  External Digital Slow Clock Requirements
    5. 8.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 8.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 8.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 8.8  WLAN Performance: Currents
    9. 8.9  Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    10. 8.10 Bluetooth Performance: Transmitter, BR
    11. 8.11 Bluetooth Performance: Transmitter, EDR
    12. 8.12 Bluetooth Performance: Modulation, BR
    13. 8.13 Bluetooth Performance: Modulation, EDR
    14. 8.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals
    15. 8.15 Bluetooth low energy Performance: Transmitter Characteristics
    16. 8.16 Bluetooth low energy Performance: Modulation Characteristics
    17. 8.17 Bluetooth BR and EDR Dynamic Currents
    18. 8.18 Bluetooth low energy Currents
    19. 8.19 Timing and Switching Characteristics
      1. 8.19.1 Power Management
        1. 8.19.1.1 Block Diagram – Internal DC-DCs
      2. 8.19.2 Power-Up and Shut-Down States
      3. 8.19.3 Chip Top-level Power-Up Sequence
      4. 8.19.4 WLAN Power-Up Sequence
      5. 8.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 8.19.6 WLAN SDIO Transport Layer
        1. 8.19.6.1 SDIO Timing Specifications
        2. 8.19.6.2 SDIO Switching Characteristics – High Rate
      7. 8.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 8.19.7.1 UART 4-Wire Interface – H4
      8. 8.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 9 Detailed Description
    1. 9.1 WLAN Features
    2. 9.2 Bluetooth Features
    3. 9.3 Bluetooth Low Energy Features
    4. 9.4 Device Certification
      1. 9.4.1 FCC Certification and Statement
      2. 9.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 9.4.3 ETSI/CE
      4. 9.4.4 MIC Certification
    5. 9.5 Module Markings
    6. 9.6 Test Grades
    7. 9.7 End Product Labeling
    8. 9.8 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application – WL1835MODGB Reference Design
      2. 10.1.2 Design Recommendations
      3. 10.1.3 RF Trace and Antenna Layout Recommendations
      4. 10.1.4 Module Layout Recommendations
      5. 10.1.5 Thermal Board Recommendations
      6. 10.1.6 Baking and SMT Recommendations
        1. 10.1.6.1 Baking Recommendations
        2. 10.1.6.2 SMT Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Tools and Software
      3. 11.1.3 Device Support Nomenclature
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Detailed Description

The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology.

Figure 9-1 shows a high-level view of the WL1835MOD variant.

GUID-9517F777-6AC3-4AD5-8F8F-7ABEF667D6C1-low.gif Figure 9-1 WL1835MOD High-Level System Diagram

 

Table 9-1, Table 9-2, and Table 9-3 list performance parameters along with shutdown and sleep currents.

Table 9-1 WLAN Performance Parameters
WLAN(1) CONDITIONS SPECIFICATION (TYP) UNIT
Maximum TX power 1-Mbps DSSS 17.3 dBm
Minimum sensitivity 1-Mbps DSSS –96.3 dBm
Sleep current Leakage, firmware retained 160 µA
Connected IDLE No traffic IDLE connect 750 µA
RX search Search (SISO20) 54 mA
RX current (SISO20) MCS7, 2.4 GHz 65 mA
TX current (SISO20) MCS7, 2.4 GHz, +11.2 dBm 238 mA
Maximum peak current consumption during calibration(2) 850 mA
(1) System design power scheme must comply with both peak and average TX bursts.
(2) Peak current VBAT can hit 850 mA during device calibration.
  • At wakeup, the WiLink 8 module performs the entire calibration sequence at the center of the 2.4-GHz band.
  • After a link is established, calibration is performed periodically (every 5 minutes) on the specific channel tuned.
  • The maximum VBAT value is based on peak calibration consumption with a 30% margin.
Table 9-2 Bluetooth Performance Parameters
Bluetooth CONDITIONS SPECIFICATION (TYP) UNIT
Maximum TX power GFSK 11.7 dBm
Minimum sensitivity GFSK –92.2 dBm
Sniff 1 attempt, 1.28 s (+4 dBm) 178 µA
Page or inquiry 1.28-s interrupt, 11.25-ms scan window (+4 dBm) 253 µA
A2DP MP3 high quality 192 kbps (+4 dBm) 7.5 mA
Table 9-3 Shutdown and Sleep Currents
PARAMETER POWER SUPPLY CURRENT TYP UNIT
Shutdown mode
All functions shut down		 VBAT 10 µA
VIO 2
WLAN sleep mode VBAT 160 µA
VIO 60
Bluetooth sleep mode VBAT 110 µA
VIO 60