Refer to the PDF data sheet for device specific package drawings
Figure 10-6 shows the recommended reflow profile for the WiLink 8 module.
|ITEM||TEMPERATURE (°C)||TIME (s)|
|Preheat||D1 to approximately D2: 140 to 200||T1: 80 to approximately 120|
|Soldering||D2: 220||T2: 60 ±10|
|Peak temperature||D3: 250 maximum||T3: 10|
TI does not recommend the use of conformal coating or similar material on the WiLink 8 module. This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Care should be taken during module assembly process to the final PCB to avoid the presence of foreign material inside the module.