JAJSW71 February   2025 ADC3683-EP , ADC3683-SEP

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - Power Consumption
    6. 5.6 Electrical Characteristics - DC Specifications
    7. 5.7 Electrical Characteristics - AC Specifications
    8. 5.8 Timing Requirements
    9. 5.9 Typical Characteristics - ADC3683
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
        1. 7.3.1.1 Analog Input Bandwidth
        2. 7.3.1.2 Analog Front End Design
          1. 7.3.1.2.1 Sampling Glitch Filter Design
          2. 7.3.1.2.2 Analog Input Termination and DC Bias
            1. 7.3.1.2.2.1 AC-Coupling
            2. 7.3.1.2.2.2 DC-Coupling
        3. 7.3.1.3 Auto-Zero Feature
      2. 7.3.2 Clock Input
        1. 7.3.2.1 Single Ended vs Differential Clock Input
        2. 7.3.2.2 Signal Acquisition Time Adjust
      3. 7.3.3 Voltage Reference
        1. 7.3.3.1 Internal voltage reference
        2. 7.3.3.2 External voltage reference (VREF)
        3. 7.3.3.3 External voltage reference with internal buffer (REFBUF/CTRL)
      4. 7.3.4 Digital Down Converter
        1. 7.3.4.1 DDC MUX
        2. 7.3.4.2 Digital Filter Operation
        3. 7.3.4.3 FS/4 Mixing with Real Output
        4. 7.3.4.4 Numerically Controlled Oscillator (NCO) and Digital Mixer
        5. 7.3.4.5 Decimation Filter
        6. 7.3.4.6 SYNC
        7. 7.3.4.7 Output Formatting with Decimation
      5. 7.3.5 Digital Data Path and Interface
        1. 7.3.5.1 Data Path Overview
        2. 7.3.5.2 Output Scrambler
        3. 7.3.5.3 Output Bit Mapper
          1. 7.3.5.3.1 2-Wire Mode
          2. 7.3.5.3.2 1-Wire Mode
          3. 7.3.5.3.3 ½-Wire Mode
        4. 7.3.5.4 Device Configuration Steps
          1. 7.3.5.4.1 Configuration Example
        5. 7.3.5.5 Output Data Format
      6. 7.3.6 Test Pattern
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Power Down Options
      3. 7.4.3 Digital Channel Averaging
    5. 7.5 Programming
      1. 7.5.1 Configuration using PINs only
      2. 7.5.2 Configuration using the SPI interface
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Signal Path
        2. 8.2.2.2 Sampling Clock
        3. 8.2.2.3 Voltage Reference
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
      1. 8.3.1 Register Initialization During Operation
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Register Map
    1. 9.1 Detailed Register Description
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

パッケージ・オプション

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メカニカル・データ（パッケージ｜ピン）
  • RSB|40
サーマルパッド・メカニカル・データ
発注情報

8.5.1 Layout Guidelines

There are several critical signals which require specific care during board design:

  1. Analog input and clock signals
    • Traces should be as short as possible and vias should be avoided where possible to minimize impedance discontinuities.
    • Traces should be routed using loosely coupled 100Ω differential traces.
    • Differential trace lengths are matched as close as possible to minimize phase imbalance and HD2 degradation.
  2. Digital output interface
    • Traces are routed using tightly coupled 100Ω differential traces.
  3. Voltage reference
    • The bypass capacitor is placed as close to the device pins as possible, and connected between VREF and REFGND on top layer avoiding vias.
    • Depending on configuration, an additional bypass capacitor between REFBUF/CTRL and REFGND is recommended, and is placed as close to pins as possible on the top layer.
  4. Power and ground connections
    • Provide low resistance connection paths to all power and ground pins.
    • Use power and ground planes instead of traces.
    • Avoid narrow, isolated paths which increase the connection resistance.
    • Use a signal, ground, or power circuit board stack up to maximize coupling between the ground and power plane.