JAJSRI9A October   2023  – March 2024 LM51772

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 概要 (続き)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Buck-Boost Control Scheme
        1. 8.3.1.1 Buck Mode
        2. 8.3.1.2 Boost Mode
        3. 8.3.1.3 Buck-Boost Mode
      2. 8.3.2  Power Save Mode
      3. 8.3.3  Programmable Conduction Mode PCM
      4. 8.3.4  Reference System
        1. 8.3.4.1 VIO LDO and nRST-PIN
      5. 8.3.5  Supply Voltage Selection – VMAX Switch and Selection Logic
      6. 8.3.6  Enable and Undervoltage Lockout
        1. 8.3.6.1 UVLO
        2. 8.3.6.2 VDET Comparator
      7. 8.3.7  Internal VCC Regulator
        1. 8.3.7.1 VCC1 Regulator
        2. 8.3.7.2 VCC2 Regulator
      8. 8.3.8  Error Amplifier and Control
        1. 8.3.8.1 Output Voltage Regulation
        2. 8.3.8.2 Internal Output Voltage Regulation
        3. 8.3.8.3 Dynamic Voltage Scaling
      9. 8.3.9  Short Circuit - Hiccup Protection
      10. 8.3.10 Current Monitor/Limiter
        1. 8.3.10.1 Overview
        2. 8.3.10.2 Output Current Limitation
        3. 8.3.10.3 Output Current Monitor
      11. 8.3.11 Oscillator Frequency Selection
      12. 8.3.12 Frequency Synchronization
      13. 8.3.13 Output Voltage Tracking
        1. 8.3.13.1 Analog Voltage Tracking
        2. 8.3.13.2 Digital Voltage Tracking
      14. 8.3.14 Slope Compensation
      15. 8.3.15 Configurable Soft Start
      16. 8.3.16 Drive Pin
      17. 8.3.17 Dual Random Spread Spectrum – DRSS
      18. 8.3.18 Gate Driver
      19. 8.3.19 Cable Drop Compensation (CDC)
      20. 8.3.20 CFG-pin and R2D Interface
      21. 8.3.21 Advanced Monitoring Features
        1. 8.3.21.1  Overview
        2. 8.3.21.2  BUSY
        3. 8.3.21.3  OFF
        4. 8.3.21.4  VOUT
        5. 8.3.21.5  IOUT
        6. 8.3.21.6  INPUT
        7. 8.3.21.7  TEMPERATURE
        8. 8.3.21.8  CML
        9. 8.3.21.9  OTHER
        10. 8.3.21.10 ILIM_OP
        11. 8.3.21.11 nFLT/nINT Pin Output
        12. 8.3.21.12 Status Byte
      22. 8.3.22 Protection Features
        1. 8.3.22.1  Thermal Shutdown (TSD)
        2. 8.3.22.2  Over Current Protection
        3. 8.3.22.3  Output Over Voltage Protection 1 (OVP1)
        4. 8.3.22.4  Output Over Voltage Protection 2 (OVP2)
        5. 8.3.22.5  Input Voltage Protection (IVP)
        6. 8.3.22.6  Input Voltage Regulation (IVR)
        7. 8.3.22.7  Power Good
        8. 8.3.22.8  Boot-Strap Under Voltage Protection
        9. 8.3.22.9  Boot-strap Over Voltage Clamp
        10. 8.3.22.10 CRC - CHECK
    4. 8.4 Device Functional Modes
      1. 8.4.1 Overview
      2. 8.4.2 Logic State Description
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
      2. 8.5.2 Clock Stretching
      3. 8.5.3 Data Transfer Formats
      4. 8.5.4 Single READ from a Defined Register Address
      5. 8.5.5 Sequential READ Starting from a Defined Register Address
      6. 8.5.6 Single WRITE to a Defined Register Address
      7. 8.5.7 Sequential WRITE Starting at a Defined Register Address
  10. 9 LM51772 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Custom Design with WEBENCH Tools
        2. 10.2.2.2  Frequency
        3. 10.2.2.3  Feedback Divider
        4. 10.2.2.4  Inductor and Current Sense Resistor Selection
        5. 10.2.2.5  Output Capacitor
        6. 10.2.2.6  Input Capacitor
        7. 10.2.2.7  Slope Compensation
        8. 10.2.2.8  UVLO Divider
        9. 10.2.2.9  Soft-Start Capacitor
        10. 10.2.2.10 MOSFETs QH1 and QL1
        11. 10.2.2.11 MOSFETs QH2 and QL2
        12. 10.2.2.12 Loop Compensation
        13. 10.2.2.13 External Component Selection
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 Power Stage Layout
        2. 10.4.1.2 Gate Driver Layout
        3. 10.4.1.3 Controller Layout
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.4.1.3 Controller Layout

With the provision to locate the controller as close as possible to the power MOSFETs to minimize gate driver trace runs, the components related to the analog and feedback signals as well as current sensing are considered in the following:

  • Separate power and signal traces, and use a ground plane to provide noise shielding.
  • Place all sensitive analog traces and components related to COMP, FB, SLOPE, SS/ATRK, and RT away from high-voltage switching nodes such as the following to avoid mutual coupling:
    • SW1
    • SW2
    • HO1
    • HO2
    • LO1
    • LO2
    • HB1
    • HB2
  • Use an internal layer or layers as ground plane or planes. Pay particular attention to shielding the feedback (FB) trace from power traces and components.
  • Route the CSA and CSB and ISNSP and ISNSN traces as differential pairs to minimize noise pickup and use Kelvin connections to the applicable shunt resistor.
  • Locate the upper and lower feedback resistors close to the FB pins, keeping the FB traces as short as possible. Route the trace from the upper feedback resistor or resistors to the output voltage sense point.
  • Use a common ground node for power ground and a different one for analog ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
  • The HTSSOP package offers a means of removing heat from the semiconductor die through the exposed thermal pad at the base of the package. While the exposed pad of the package is not directly connected to any leads of the package, it is thermally connected to the substrate (ground) of the device. This connection allows a significant improvement in heat sinking, and it becomes imperative that the PCB is designed with thermal lands, thermal vias, and a ground plane to complete the heat removal subsystem.