JAJSN98E May   2020  – February 2024 UCC5350-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. 概要 (続き)
  6. Pin Configuration and Function
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications for D Package
    7. 6.7  Insulation Specifications for DWV Package
    8. 6.8  Safety-Related Certifications For D Package
    9. 6.9  Safety-Related Certifications For DWV Package
    10. 6.10 Safety Limiting Values
    11. 6.11 Electrical Characteristics
    12. 6.12 Switching Characteristics
    13. 6.13 Insulation Characteristics Curves
    14. 6.14 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Propagation Delay, Inverting, and Noninverting Configuration
      1. 7.1.1 CMTI Testing
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supply
      2. 8.3.2 Input Stage
      3. 8.3.3 Output Stage
      4. 8.3.4 Protection Features
        1. 8.3.4.1 Undervoltage Lockout (UVLO)
        2. 8.3.4.2 Active Pulldown
        3. 8.3.4.3 Short-Circuit Clamping
        4. 8.3.4.4 Active Miller Clamp
    4. 8.4 Device Functional Modes
      1. 8.4.1 ESD Structure
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Designing IN+ and IN– Input Filter
        2. 9.2.2.2 Gate-Driver Output Resistor
        3. 9.2.2.3 Estimate Gate-Driver Power Loss
        4. 9.2.2.4 Estimating Junction Temperature
      3. 9.2.3 Selecting VCC1 and VCC2 Capacitors
        1. 9.2.3.1 Selecting a VCC1 Capacitor
        2. 9.2.3.2 Selecting a VCC2 Capacitor
        3. 9.2.3.3 Application Circuits with Output Stage Negative Bias
      4. 9.2.4 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 PCB Material
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 サード・パーティ製品に関する免責事項
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Certifications
    4. 12.4 ドキュメントの更新通知を受け取る方法
    5. 12.5 サポート・リソース
    6. 12.6 Trademarks
    7. 12.7 静電気放電に関する注意事項
    8. 12.8 用語集
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Revision History

Changes from Revision D (August 2022) to Revision E (February 2024)

  • Changed CTI and Material Group values in insulation specifications and added table noteGo

Changes from Revision C (June 2022) to Revision D (August 2022)

  • UCC5350SB-Q1 を「事前情報」から「量産データ」に変更Go

Changes from Revision B (June 2020) to Revision C (June 2022)

  • UCC5350SBQDRQ1 デバイスの事前情報を追加Go
  • 追加 セクション 4 Go
  • Added the UCC5350SB device to Section 5 Go
  • Added SB-Q1 D package power ratingsGo
  • Added SB-Q1 insulation specsGo
  • Added the UL certificate number for the D packageGo
  • Added the UL certificate number for the DWV packageGo
  • Added SB-Q1 D package safety limiting valuesGo
  • Added SB-Q1 parametersGo
  • Added minimum pulse width specsGo
  • Added Table 8-4 Go
  • Added SB-Q1 ESD figure Go
  • Added typical application circuit for SB-Q1Go