SLYA048B March   2020  – June 2021 FDC1004 , FDC1004-Q1 , FDC2112 , FDC2112-Q1 , FDC2114 , FDC2114-Q1 , FDC2212 , FDC2212-Q1 , FDC2214 , FDC2214-Q1 , LDC0851 , LDC1001 , LDC1041 , LDC1051 , LDC1101 , LDC1312 , LDC1312-Q1 , LDC1314 , LDC1314-Q1 , LDC1612 , LDC1612-Q1 , LDC1614 , LDC1614-Q1 , LDC2112 , LDC2114 , LDC3114 , LDC3114-Q1

 

  1.   Trademarks
  2. 1Inductive and Capacitive Theory of Operation
    1. 1.1 Inductive Sensing Theory of Operation
    2. 1.2 Capacitive Sensing Theory of Operation
  3. 2FDC: Capacitive Level Sensing
    1. 2.1 Capacitive Technology Benefits in Liquid Level Sensing
    2. 2.2 Getting Started With Capacitive Liquid Level Sensing
    3. 2.3 Device Selection
    4. 2.4 Design Challenges and Additional Collateral
  4. 3LDC: Inductive Touch Buttons
    1. 3.1 Inductive Technology Benefits in Buttons
    2. 3.2 Getting Started With Inductive Buttons
    3. 3.3 Device Selection
    4. 3.4 Design Challenges and Additional Collateral
  5. 4LDC: Incremental Encoder and Event Counting
    1. 4.1 Inductive Technology Benefits in Incremental Encoders
    2. 4.2 Getting Started With an Inductive Incremental Encoder
    3. 4.3 Device Recommendations
    4. 4.4 Design Challenges and Additional Collateral
  6. 5LDC: Metal Proximity Sensor
    1. 5.1 Inductive Technology Benefits in Metal Proximity Detection
    2. 5.2 Criteria to Consider when Choosing Inductive Sensing for Metal Proximity Applications
      1. 5.2.1 Metal Target Movement in Relation to Inductive Coil
      2. 5.2.2 Sensing Distance
      3. 5.2.3 Size and Shape of Metal Target
      4. 5.2.4 Speed (Sample Rate versus Resolution)
      5. 5.2.5 Environmental Compensation
    3. 5.3 Getting Started With Inductive Metal Proximity Sensing
    4. 5.4 Device Recommendations
    5. 5.5 Design Challenges and Additional Collateral
  7. 6Revision History

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated