SPRUIY9C May   2021  – December 2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Device Information
  6. 2Hardware
    1. 2.1 EVM Revisions and Assembly Variants
    2. 2.2 Important Usage Notes
    3. 2.3 System Description
      1. 2.3.1 Functional Block Diagram
      2. 2.3.2 Power-On/Off Procedures
        1. 2.3.2.1 Power-On Procedure
        2. 2.3.2.2 Power-Off Procedure
      3. 2.3.3 Peripheral and Major Component Description
        1. 2.3.3.1  Clocking
          1. 2.3.3.1.1 Ethernet PHY Clock
          2. 2.3.3.1.2 AM64x SoC Clock
        2. 2.3.3.2  Reset
        3. 2.3.3.3  Power
          1. 2.3.3.3.1 Power Input
          2. 2.3.3.3.2 USB Type-C Interface for Power Input
          3. 2.3.3.3.3 Power Fault Indication
          4. 2.3.3.3.4 Power Supply
          5. 2.3.3.3.5 Power Sequencing
          6. 2.3.3.3.6 Power Supply
        4. 2.3.3.4  Configuration
          1. 2.3.3.4.1 Boot Modes
        5. 2.3.3.5  JTAG
        6. 2.3.3.6  Test Automation
        7. 2.3.3.7  UART Interface
        8. 2.3.3.8  Memory Interfaces
          1. 2.3.3.8.1 LPDDR4 Interface
          2. 2.3.3.8.2 MMC Interface
            1. 2.3.3.8.2.1 Micro SD Interface
            2. 2.3.3.8.2.2 WiLink Interface
            3. 2.3.3.8.2.3 OSPI Interface
            4. 2.3.3.8.2.4 Board ID EEPROM Interface
        9. 2.3.3.9  Ethernet Interface
          1. 2.3.3.9.1 DP83867 PHY Default Configuration
          2. 2.3.3.9.2 DP83867 – Power, Clock, Reset, Interrupt and LEDs
          3. 2.3.3.9.3 Industrial Application LEDs
        10. 2.3.3.10 USB 3.0 Interface
        11. 2.3.3.11 PRU Connector
        12. 2.3.3.12 User Expansion Connector
        13. 2.3.3.13 MCU Connector
        14. 2.3.3.14 Interrupt
        15. 2.3.3.15 I2C Interface
        16. 2.3.3.16 IO Expander (GPIOs)
  7. 3Hardware Design Files
  8. 4Compliance Information
    1. 4.1 Regulatory Compliance
  9. 5Additional Information
    1. 5.1 Known Issues
      1. 5.1.1 Issue 1: LP8733x Max output Capacitance Spec Exceeded on LDO0 and LDO1
      2. 5.1.2 Issue 2: LP8733x Output Voltage of 0.9V Exceeds AM64x VDDR_CORE max Voltage Spec of 0.895 V
      3. 5.1.3 Issue 3 - SDIO Devices on MMC0 Require Careful Trace Lengths to Meet Interface Timing Requirements
      4. 5.1.4 Issue 4 - LPDDR4 Data Rate Limitation in Stressful Conditions
      5. 5.1.5 Issue 5 - Junk Character
      6. 5.1.6 Issue 6 - Test Power Down Signal Floating
      7. 5.1.7 Issue 7 - uSD Boot Not Working
    2.     Trademarks
    3.     65
  10. 6Revision History

5.1.1 Issue 1: LP8733x Max output Capacitance Spec Exceeded on LDO0 and LDO1

Affected PCB version: E1, E2, E3

Severity: High

On the Starter Kit, LDO0 supplies VDDAR_CORE (0.85V core voltage domain). The 4.7uF point-of-load capacitors are overly conservative and can be reduced to 1uF, bringing the total output capacitance seen by LDO0 more in line with the CLDO_OUT max specification.

On the Starter Kit, LDO1 supplies the AM64x 1V8 analog domain and capacitance requirements far in excess of LDO1’s CLDO_OUT max specification, mostly due to large 22uF point-of-load capacitor on VDDA_1P8_SERDES0. TI is taking a multipronged approach to resolving this issue and publishing final capacitor value recommendations in the future. First, LP8733xx CLDO_OUT max spec is overly conservative and is revised higher in the data sheet. Second, system-level simulations are being conducted to assess actual decoupling capacitor requirements on VDDA_1P8_SERDES0. Because this work is ongoing, TI recommends to not copy this power solution for a production system.

For customers desiring an integrated PMIC solution, Texas Instruments is currently developing a PMIC that meets the needs of the AM64x processor family, and are featured on an upcoming AM64x Starter Kit revision.