DLPS269A March   2025  – June 2025 DLP991UUV

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  Storage Conditions
   3. 5.3  ESD Ratings
   4. 5.4  Recommended Operating Conditions
   5. 5.5  Thermal Information
   6. 5.6  Electrical Characteristics
   7. 5.7  Switching Characteristics
   8. 5.8  Timing Requirements
   9. 5.9  System Mounting Interface Loads
   10. 5.10 Micromirror Array Physical Characteristics
   11. 5.11 Micromirror Array Optical Characteristics
   12. 5.12 Window Characteristics
   13. 5.13 Chipset Component Usage Specification
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
   4. 6.4 Device Functional Modes
   5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
   6. 6.6 DMD Temperature Calculation
      1. 6.6.1 Off-State Thermal Differential (TDELTA_MIN)
      2. 6.6.2 On-State Thermal Differential (TDELTA_MAX)
   7. 6.7 Micromirror Power Density Calculation
   8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 7 Application and Implementation
   1. 7.1 Application Information
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
   3. 7.3 DMD Die Temperature Sensing
9. 8 Power Supply Recommendations
   1. 8.1 DMD Power Supply Power-Up Procedure
   2. 8.2 DMD Power Supply Power-Down Procedure
10. 9 Layout
    1. 9.1 Layout Guidelines
       1. 9.1.1 PCB Design Standards
       2. 9.1.2 General PCB Routing
          1. 9.1.2.1 Trace Impedance and Routing Priority
          2. 9.1.2.2 Example PCB Layer Stack-Up
          3. 9.1.2.3 Trace Width, Spacing
          4. 9.1.2.4 Power and Ground Planes
          5. 9.1.2.5 Trace Length Matching
             1. 9.1.2.5.1 HSSI Input Bus Skew
             2. 9.1.2.5.2 Other Timing Critical Signals
11. 10Device and Documentation Support
    1. 10.1 Device Support
       1. 10.1.1 Device Nomenclature
       2. 10.1.2 Device Markings
    2. 10.2 Documentation Support
       1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum