DLPS289A June   2025  – September 2025 DLP391TP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Switching Characteristics
    9. 5.8  Timing Requirements
    10.     16
    11. 5.9  System Mounting Interface Loads
    12.     18
    13. 5.10 Micromirror Array Physical Characteristics
    14.     20
    15. 5.11 Micromirror Array Optical Characteristics
    16. 5.12 Window Characteristics
    17. 5.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 LPSDR Low-Speed Interface
      3. 6.3.3 High-Speed Interface
      4. 6.3.4 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.9.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.9.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.9.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Temperature Sensor Diode
  9. Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. Layout
    1. 9.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

DLP391TP LPSDR Switching Parameters
The low-speed interface is LPSDR and adheres to the Electrical Characteristics and AC/DC Operating Conditions table in JEDEC Standard No. 209B, Low Power Double Data Rate (LPDDR) JESD209B.
Figure 5-3 LPSDR Switching Parameters
DLP391TP LPSDR Input Rise and Fall Slew Rate Figure 5-4 LPSDR Input Rise and Fall Slew Rate
DLP391TP SubLVDS Input Rise and Fall Slew Rate Figure 5-5 SubLVDS Input Rise and Fall Slew Rate
DLP391TP Window Time Derating Concept Figure 5-6 Window Time Derating Concept
DLP391TP SubLVDS Switching Parameters Figure 5-7 SubLVDS Switching Parameters
DLP391TP High-Speed Training Scan Window
Refer to Timing Requirements for details.
Figure 5-8 High-Speed Training Scan Window
DLP391TP SubLVDS Voltage Parameters Figure 5-9 SubLVDS Voltage Parameters
DLP391TP SubLVDS Waveform Parameters Figure 5-10 SubLVDS Waveform Parameters
DLP391TP SubLVDS Equivalent Input Circuit Figure 5-11 SubLVDS Equivalent Input Circuit
DLP391TP LPSDR Input Hysteresis Figure 5-12 LPSDR Input Hysteresis
DLP391TP LPSDR Read Out Figure 5-13 LPSDR Read Out
DLP391TP Test Load Circuit for Output Propagation
                                                  Measurement
See Section 6.3.4 for more information.
Figure 5-14 Test Load Circuit for Output Propagation Measurement