SBAS501D May   2013  – May 2026 ADS1220

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 SPI Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Multiplexer
      2. 8.3.2  Low-Noise PGA
        1. 8.3.2.1 PGA Common-Mode Voltage Requirements
        2. 8.3.2.2 Bypassing the PGA
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Clock Source
      5. 8.3.5  Modulator
      6. 8.3.6  Digital Filter
      7. 8.3.7  Output Data Rate
      8. 8.3.8  Excitation Current Sources
      9. 8.3.9  Low-Side Power Switch
      10. 8.3.10 Sensor Detection
      11. 8.3.11 System Monitor
      12. 8.3.12 Offset Calibration
      13. 8.3.13 Temperature Sensor
        1. 8.3.13.1 Converting From Digital Codes to Temperature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
      2. 8.4.2 Conversion Modes
        1. 8.4.2.1 Single-Shot Conversion Mode
        2. 8.4.2.2 Continuous Conversion Mode
      3. 8.4.3 Operating Modes
        1. 8.4.3.1 Normal Mode
        2. 8.4.3.2 Duty-Cycle Mode
        3. 8.4.3.3 Turbo Mode
        4. 8.4.3.4 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Ready ( DRDY)
        4. 8.5.1.4 Data Input (DIN)
        5. 8.5.1.5 Data Output and Data Ready (DOUT/DRDY)
        6. 8.5.1.6 SPI Timeout
      2. 8.5.2 Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 RESET (0000 011xb)
        2. 8.5.3.2 START/SYNC (0000 100xb)
        3. 8.5.3.3 POWERDOWN (0000 001xb)
        4. 8.5.3.4 RDATA (0001 xxxxb)
        5. 8.5.3.5 RREG (0010 rrnnb)
        6. 8.5.3.6 WREG (0100 rrnnb)
      4. 8.5.4 Reading Data
      5. 8.5.5 Sending Commands
      6. 8.5.6 Interfacing with Multiple Devices
    6. 8.6 Register Map
      1. 8.6.1 Configuration Registers
      2. 8.6.2 Register Descriptions
        1. 8.6.2.1 Configuration Register 0 (Address = 00h) [reset = 00h]
        2. 8.6.2.2 Configuration Register 1 (Address = 01h) [reset = 00h]
        3. 8.6.2.3 Configuration Register 2 (Address = 02h) [reset = 00h]
        4. 8.6.2.4 Configuration Register 3 (Address = 03h) [reset = 00h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 Analog Input Filtering
      3. 9.1.3 External Reference and Ratiometric Measurements
      4. 9.1.4 Establishing a Proper Common-Mode Input Voltage
      5. 9.1.5 Unused Inputs and Outputs
      6. 9.1.6 Pseudo Code Example
    2. 9.2 Typical Applications
      1. 9.2.1 K-Type Thermocouple Measurement (–200°C to +1250°C)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 3-Wire RTD Measurement (–200°C to +850°C)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Design Variations for 2-Wire and 4-Wire RTD Measurements
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Resistive Bridge Measurement
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Supply Sequencing
      2. 9.3.2 Power-Supply Ramp Rate
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

ADS1220 RVA Package,16-Pin VQFN(Top View)Figure 5-1 RVA Package,16-Pin VQFN
ADS1220 PW Package,16-Pin TSSOP(Top View)Figure 5-2 PW Package,16-Pin TSSOP
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION(1)
NAME NO.
RVA PW
AIN0/REFP1 9 11 Analog input Analog input 0, positive reference input 1
AIN1 8 10 Analog input Analog input 1
AIN2 5 7 Analog input Analog input 2
AIN3/REFN1 4 6 Analog input Analog input 3, negative reference input 1.
Internal low-side power switch connected between AIN3/REFN1 and AVSS.
AVDD 10 12 Analog supply Positive analog power supply. Connect a 100nF (or larger) capacitor to AVSS.
AVSS 3 5 Analog supply Negative analog power supply
CLK 1 3 Digital input External clock source pin. Connect to DGND if not used.
CS 16 2 Digital input Chip select; active low. Connect to DGND if not used.
DGND 2 4 Digital supply Digital ground
DIN 14 16 Digital input Serial data input
DOUT/ DRDY 13 15 Digital output Serial data output combined with data ready; active low
DRDY 12 14 Digital output Data ready, active low.
Leave unconnected or tie to DVDD using a weak pull-up resistor if not used.
DVDD 11 13 Digital supply Positive digital power supply. Connect a 100nF (or larger) capacitor to DGND.
REFN0 6 8 Analog input Negative reference input 0
REFP0 7 9 Analog input Positive reference input 0
SCLK 15 1 Digital input Serial clock input
Thermal pad Pad — — Thermal power pad. Do not connect or only connect to AVSS.
(1) See the Unused Inputs and Outputs section for unused pin connections.