SBAS501D May   2013  – May 2026 ADS1220

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 SPI Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Multiplexer
      2. 8.3.2  Low-Noise PGA
        1. 8.3.2.1 PGA Common-Mode Voltage Requirements
        2. 8.3.2.2 Bypassing the PGA
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Clock Source
      5. 8.3.5  Modulator
      6. 8.3.6  Digital Filter
      7. 8.3.7  Output Data Rate
      8. 8.3.8  Excitation Current Sources
      9. 8.3.9  Low-Side Power Switch
      10. 8.3.10 Sensor Detection
      11. 8.3.11 System Monitor
      12. 8.3.12 Offset Calibration
      13. 8.3.13 Temperature Sensor
        1. 8.3.13.1 Converting From Digital Codes to Temperature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
      2. 8.4.2 Conversion Modes
        1. 8.4.2.1 Single-Shot Conversion Mode
        2. 8.4.2.2 Continuous Conversion Mode
      3. 8.4.3 Operating Modes
        1. 8.4.3.1 Normal Mode
        2. 8.4.3.2 Duty-Cycle Mode
        3. 8.4.3.3 Turbo Mode
        4. 8.4.3.4 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Ready ( DRDY)
        4. 8.5.1.4 Data Input (DIN)
        5. 8.5.1.5 Data Output and Data Ready (DOUT/DRDY)
        6. 8.5.1.6 SPI Timeout
      2. 8.5.2 Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 RESET (0000 011xb)
        2. 8.5.3.2 START/SYNC (0000 100xb)
        3. 8.5.3.3 POWERDOWN (0000 001xb)
        4. 8.5.3.4 RDATA (0001 xxxxb)
        5. 8.5.3.5 RREG (0010 rrnnb)
        6. 8.5.3.6 WREG (0100 rrnnb)
      4. 8.5.4 Reading Data
      5. 8.5.5 Sending Commands
      6. 8.5.6 Interfacing with Multiple Devices
    6. 8.6 Register Map
      1. 8.6.1 Configuration Registers
      2. 8.6.2 Register Descriptions
        1. 8.6.2.1 Configuration Register 0 (Address = 00h) [reset = 00h]
        2. 8.6.2.2 Configuration Register 1 (Address = 01h) [reset = 00h]
        3. 8.6.2.3 Configuration Register 2 (Address = 02h) [reset = 00h]
        4. 8.6.2.4 Configuration Register 3 (Address = 03h) [reset = 00h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 Analog Input Filtering
      3. 9.1.3 External Reference and Ratiometric Measurements
      4. 9.1.4 Establishing a Proper Common-Mode Input Voltage
      5. 9.1.5 Unused Inputs and Outputs
      6. 9.1.6 Pseudo Code Example
    2. 9.2 Typical Applications
      1. 9.2.1 K-Type Thermocouple Measurement (–200°C to +1250°C)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 3-Wire RTD Measurement (–200°C to +850°C)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Design Variations for 2-Wire and 4-Wire RTD Measurements
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Resistive Bridge Measurement
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Supply Sequencing
      2. 9.3.2 Power-Supply Ramp Rate
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

11 Revision History

Changes from August 1, 2016 to May 18, 2026 (from Revision C (August 2016) to Revision D (May 2026))

  • Removed Package bullet in Features sectionGo
  • Changed Applications bullets on first pageGo
  • Changed Device Information table to Package Information table and added table note in Description section.Go
  • Changed K-Type Thermocouple Measurement image in Description section.Go
  • Added Device Comparison tableGo
  • Changed Pin Functions descriptions of AVDD, AVSS, DVDD, and DGND pinsGo
  • Changed VREF maximum value from AVDD to AVDD – AVSS in Recommended Operating Conditions tableGo
  • Changed SPI timeout from 13955 × tMOD to 14000 × tMOD for normal mode and duty-cycle mode, and from 27910 × tMOD to 28000 × tMOD for turbo mode in SPI Timing Requirements table.Go
  • Added Timing Diagrams sectionGo
  • Changed ENOB to Effective Resolution, and changed Noise-Free-Bits to Noise-Free Resolution in Noise Performance section.Go
  • Changed Functional Block Diagram figureGo
  • Changed first and third paragraphs in Multiplexer section.Go
  • Changed first paragraph and added Gain Implementation table in Low-Noise PGA section Go
  • Changed first sentence in Bypassing the PGA section.Go
  • Changed last sentence in the second paragraph in Bypassing the PGA section describing the device behavior while using PGA_BYPASS and gains greater than 4Go
  • Changed the location of the Voltage Reference and Clock Source sections.Go
  • Changed first paragraph in Digital Filter section.Go
  • Changed Turbo Mode, 40 SPS, -3dB Bandwidth Hz from 26.2 to 17.1 in Conversion Times table in Output Data Rate section.Go
  • Changed first and second paragraph in Excitation Current Sources sectionGo
  • Changed first paragraph in System Monitor sectionGo
  • Changed first paragraph and examples in Converting from Digital Codes to Temperature sectionGo
  • Added 14-Bit Temperature Sensor Data Alignment Within 24-Bit Conversion Result figure in Converting From Digital Codes to Temperature sectionGo
  • Removed Converting From Temperature to Digital codes sectionGo
  • Changed the name of the Single-Shot Mode section to Single-Shot Conversion Mode Go
  • Changed second paragraph in Data Output and Data Ready (DOUT/DRDY) section.Go
  • Changed timout period from 13955 × tMOD to 14000 × tMOD for normal mode and duty-cycle mode, and from 27910 × tMOD to 28000 × tMOD for turbo mode in SPI Timeout sectionGo
  • Added note after Code Transition Diagram in Data Format section.Go
  • Changed bit setting notation from hexadecimal to binary where beneficial throughout Register Map section.Go
  • Added Register Descriptions section and Register Access Type Codes table to Register Map section.Go
  • Changed bit 0 in register 03h from 0 to RESERVEDGo
  • Changed third and fourth paragraphs in Detailed Design Procedure in K-Type Thermocouple Measurement section.Go

Changes from Revision B (February 2015) to Revision C (August 2016)

  • Changed K-Type Thermocouple Measurement figureGo
  • Added footnote 1 to Pin Functions table and changed descriptions of AIN0/REFP1, AIN1, AIN2, AIN3/REFN1, REFN0, and REFP0 pins accordinglyGo
  • Changed Functional Block Diagram figureGo
  • Changed Bypassing the PGA sectionGo
  • Added fourth sentence to Temperature Sensor sectionGo
  • Changed last equation in Converting from Digital Codes to Temperature sectionGo
  • Changed description of bits 5:4 in Configuration Register 2 Go
  • Added Unused Inputs and Outputs section Go
  • Changed Figure 9-3 Go
  • Changed Figure 9-6 Go
  • Changed Figure 9-7 Go
  • Changed Figure 9-8 Go
  • Changed Figure 9-11 Go
  • Changed Power Supply Recommendations section: changed Power-Supply Sequencing subsection, added Power-Supply Ramp Rate subsectionGo