SBAS501D May   2013  – May 2026 ADS1220

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 SPI Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Noise Performance
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Multiplexer
      2. 8.3.2  Low-Noise PGA
        1. 8.3.2.1 PGA Common-Mode Voltage Requirements
        2. 8.3.2.2 Bypassing the PGA
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Clock Source
      5. 8.3.5  Modulator
      6. 8.3.6  Digital Filter
      7. 8.3.7  Output Data Rate
      8. 8.3.8  Excitation Current Sources
      9. 8.3.9  Low-Side Power Switch
      10. 8.3.10 Sensor Detection
      11. 8.3.11 System Monitor
      12. 8.3.12 Offset Calibration
      13. 8.3.13 Temperature Sensor
        1. 8.3.13.1 Converting From Digital Codes to Temperature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
      2. 8.4.2 Conversion Modes
        1. 8.4.2.1 Single-Shot Conversion Mode
        2. 8.4.2.2 Continuous Conversion Mode
      3. 8.4.3 Operating Modes
        1. 8.4.3.1 Normal Mode
        2. 8.4.3.2 Duty-Cycle Mode
        3. 8.4.3.3 Turbo Mode
        4. 8.4.3.4 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Ready ( DRDY)
        4. 8.5.1.4 Data Input (DIN)
        5. 8.5.1.5 Data Output and Data Ready (DOUT/DRDY)
        6. 8.5.1.6 SPI Timeout
      2. 8.5.2 Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 RESET (0000 011xb)
        2. 8.5.3.2 START/SYNC (0000 100xb)
        3. 8.5.3.3 POWERDOWN (0000 001xb)
        4. 8.5.3.4 RDATA (0001 xxxxb)
        5. 8.5.3.5 RREG (0010 rrnnb)
        6. 8.5.3.6 WREG (0100 rrnnb)
      4. 8.5.4 Reading Data
      5. 8.5.5 Sending Commands
      6. 8.5.6 Interfacing with Multiple Devices
    6. 8.6 Register Map
      1. 8.6.1 Configuration Registers
      2. 8.6.2 Register Descriptions
        1. 8.6.2.1 Configuration Register 0 (Address = 00h) [reset = 00h]
        2. 8.6.2.2 Configuration Register 1 (Address = 01h) [reset = 00h]
        3. 8.6.2.3 Configuration Register 2 (Address = 02h) [reset = 00h]
        4. 8.6.2.4 Configuration Register 3 (Address = 03h) [reset = 00h]
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 Analog Input Filtering
      3. 9.1.3 External Reference and Ratiometric Measurements
      4. 9.1.4 Establishing a Proper Common-Mode Input Voltage
      5. 9.1.5 Unused Inputs and Outputs
      6. 9.1.6 Pseudo Code Example
    2. 9.2 Typical Applications
      1. 9.2.1 K-Type Thermocouple Measurement (–200°C to +1250°C)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 3-Wire RTD Measurement (–200°C to +850°C)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Design Variations for 2-Wire and 4-Wire RTD Measurements
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Resistive Bridge Measurement
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Supply Sequencing
      2. 9.3.2 Power-Supply Ramp Rate
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Detailed Design Procedure

The circuit in Figure 9-6 employs a ratiometric measurement approach. In other words, the sensor signal (that is, the voltage across the RTD in this case) and the reference voltage for the ADC are derived from the same excitation source. Therefore, errors resulting from temperature drift or noise of the excitation source cancel because these errors are common to both the sensor signal and the reference.

To implement a ratiometric 3-wire RTD measurement using the device, IDAC1 is routed to one of the leads of the RTD and IDAC2 is routed to the second RTD lead. Both currents have the same value, which is programmable by the IDAC[2:0] bits in the configuration register. The device is designed such that both IDAC values are closely matched, even across temperature. The sum of both currents flows through a precision, low-drift reference resistor, RREF. The voltage, VREF, generated across the reference resistor (as shown in Equation 18) is used as the ADC reference voltage. Equation 18 reduces to Equation 19 because IIDAC1 = IIDAC2.

Equation 18. VREF = (IIDAC1 + IIDAC2) × RREF
Equation 19. VREF = 2 × IIDAC1 × RREF

To simplify the following discussion, the individual lead resistance values of the RTD (RLEADx) are set to zero. Only IDAC1 excites the RTD to produce a voltage (VRTD) proportional to the temperature-dependable RTD value and the IDAC1 value, as shown in Equation 20.

Equation 20. VRTD = RRTD (at temperature) × IIDAC1

The device internally amplifies the voltage across the RTD using the PGA and compares the resulting voltage against the reference voltage to produce a digital output code proportional to Equation 21 through Equation 23:

Equation 21. Code ∝ VRTD × Gain / VREF
Equation 22. Code ∝ (RRTD (at temperature) × IIDAC1 × Gain) / (2 × IIDAC1 × RREF)
Equation 23. Code ∝ (RRTD (at temperature) × Gain) / (2 × RREF)

As can be seen from Equation 23, the output code only depends on the value of the RTD, the PGA gain, and the reference resistor (RREF), but not on the IDAC1 value. The absolute accuracy and temperature drift of the excitation current therefore does not matter. However, because the value of the reference resistor directly affects the measurement result, choosing a reference resistor with a very low temperature coefficient is important to limit errors introduced by the temperature drift of RREF.

The second IDAC2 is used to compensate for errors introduced by the voltage drop across the lead resistance of the RTD. All three leads of a 3-wire RTD typically have the same length and, thus, the same lead resistance. Also, IDAC1 and IDAC2 have the same value. Taking the lead resistance into account, the differential voltage (VIN) across the ADC inputs, AIN0 and AIN1, is calculated using Equation 24:

Equation 24. VIN = IIDAC1 × (RRTD + RLEAD1) – IIDAC2 × RLEAD2

When RLEAD1 = RLEAD2 and IIDAC1 = IIDAC2, Equation 24 reduces to Equation 25:

Equation 25. VIN = IIDAC1 × RRTD

In other words, the measurement error resulting from the voltage drop across the RTD lead resistance is compensated, as long as the lead resistance values and the IDAC values are well matched.

A first-order differential and common-mode RC filter (RF1, RF2, CDIF1, CCM1, and CCM2) is placed on the ADC inputs, as well as on the reference inputs (RF3, RF4, CDIF2, CCM3, and CCM4). The same guidelines for designing the input filter apply as described in the Thermocouple Measurement section. Match the corner frequencies of the input and reference filter for best performance. More detailed information on matching the input and reference filter can be found in the RTD Ratiometric Measurements and Filtering Using the ADS1148 and ADS1248 application note.

The reference resistor RREF not only serves to generate the reference voltage for the device, but also sets the common-mode voltage of the RTD to within the specified common-mode voltage range of the PGA.

When designing the circuit, care must also be taken to meet the compliance voltage requirement of the IDACs. The IDACs require that the maximum voltage drop developed across the current path to AVSS be equal or less than AVDD – 0.9V to operate accurately. This requirement means that Equation 26 must be met at all times.

Equation 26. AVSS + IIDAC1 × (RLEAD1 + RRTD) + (IIDAC1 + IIDAC2) × (RLEAD3 + RREF) ≤ AVDD – 0.9V

The device also offers the possibility to route the IDACs to the same inputs used for measurement. If the filter resistor values RF1 and RF2 are small enough and well matched, IDAC1 can be routed to AIN1 and IDAC2 to AIN0 in Figure 9-6. In this manner, even two 3-wire RTDs sharing the same reference resistor can be measured with a single device.

This design example discusses the implementation of a 3-wire Pt100 measurement to be used to measure temperatures ranging from –200°C to +850°C as stated in Table 9-3. The excitation current for the Pt100 is chosen as IIDAC1 = 500µA, which means a combined current of 1mA is flowing through the reference resistor, RREF. As mentioned previously, besides creating the reference voltage for the ADS1220, the voltage across RREF also sets the common-mode voltage for the RTD measurement. In general, select the largest reference voltage possible while still maintaining the compliance voltage of the IDACs as well as meeting the common-mode voltage requirement of the PGA. Set the common-mode voltage at or near half the analog supply (in this case 3.3V / 2 = 1.65V), which in most cases satisfies the common-mode voltage requirements of the PGA. The value for RREF is then calculated by Equation 27:

Equation 27. RREF = VREF / (IIDAC1 + IIDAC2) = 1.65V / 1mA = 1.65kΩ

The stability of RREF is critical to achieve good measurement accuracy over temperature and time. Choosing a reference resistor with a temperature coefficient of ±10ppm/°C or better is advisable. If a 1.65kΩ value is not readily available, another value near 1.65kΩ (such as 1.62kΩ or 1.69kΩ) can certainly be used as well.

As a last step, the PGA gain must be selected to match the maximum input signal to the FSR of the ADC. The resistance of a Pt100 increases with temperature. Therefore, the maximum voltage to be measured (VINMAX) occurs at the positive temperature extreme. At 850°C, a Pt100 has an equivalent resistance of approximately 391Ω as per the NIST tables. The voltage across the Pt100 equates to Equation 28:

Equation 28. VINMAX = VRTD (at 850°C) = RRTD (at 850°C) × IIDAC1 = 391Ω × 500µA = 195.5mV

The maximum gain that can be applied when using a 1.65V reference is then calculated as (1.65V / 195.5mV) = 8.4. The next smaller PGA gain setting available in the ADS1220 is 8. At a gain of 8, the ADS1220 offers a FSR value as described in Equation 29:

Equation 29. FSR = ±VREF / Gain = ±1.65V / 8 = ±206.25mV

This range allows for margin with respect to initial accuracy and drift of the IDACs and reference resistor.

After selecting the values for the IDACs, RREF, and PGA gain, make sure to double check that the settings meet the common-mode voltage requirements of the PGA and the compliance voltage of the IDACs. To determine the true common-mode voltage at the ADC inputs (AIN0 and AIN1) the lead resistance must be taken into account as well.

The smallest common-mode voltage occurs at the lowest measurement temperature (–200°C) with RLEADx = 0Ω and is calculated using Equation 30 and Equation 31.

Equation 30. VCMMIN = VREF + (IIDAC1 + IIDAC2) × RLEAD3 + IIDAC2 × RLEAD2 + ½ IIDAC1 × RRTD (at –200°C)
Equation 31. VCMMIN = 1.65V + ½ 500µA × 18.52Ω = 1.655V

Actually, assuming VCMMIN = VREF is a sufficient approximation.

VCMMIN must meet two requirements: Equation 14 requires VCMMIN to be larger than AVDD / 4 = 3.3V / 4 = 0.825V and Equation 12 requires VCMMIN to meet Equation 32:

Equation 32. VCMMIN ≥ AVSS + 0.2V + ½ Gain × VINMAX = 0V + 0.2V + ( ½ × 8 × 195.5mV) = 982mV

Both restrictions are satisfied in this design with a VCMMIN = 1.65V.

The largest common-mode voltage occurs at the highest measurement temperature (850°C) and is calculated using Equation 33 and Equation 34.

Equation 33. VCMMAX = VREF + (IIDAC1 + IIDAC2) × RLEAD3 + IIDAC2 × RLEAD2 + ½ IIDAC1 × RRTD (at 850°C)
Equation 34. VCMMAX = 1.65V + 1mA × 15Ω + 500µA × 15Ω + ½ × 500µA × 391Ω = 1.77V

VCMMAX does meet the requirement given by Equation 13, which in this design equates to Equation 35:

Equation 35. VCMMAX ≤ AVDD – 0.2V – ½ Gain × VINMAX = 3.3V – 0.2V – ( ½ × 8 × 195.5mV) = 2.318V

Finally, the maximum voltage that can occur on input AIN1 must be calculated to determine if the compliance voltage (AVDD – 0.9V = 3.3V – 0.9V = 2.4V) of IDAC1 is met. The voltage on input AIN0 is smaller than the one on input AIN1. Equation 36 and Equation 37 show that the voltage on AIN1 is less than 2.4V, even when taking the worst-case lead resistance into account.

Equation 36. VAIN1 (MAX) = VREF + (IIDAC1 + IIDAC2) × RLEAD3 + IIDAC1 × (RRTD (at 850°C) + RLEAD1)
Equation 37. VAIN1 (MAX) = 1.65V + 1mA × 15Ω + 500µA × (391Ω + 15Ω) = 1.868V

The register settings for this design are shown in Table 9-4.

Table 9-4 Register Settings
REGISTER SETTING DESCRIPTION
00h 66h AINP = AIN1, AINN = AIN0, gain = 8, PGA enabled
01h 04h DR = 20SPS, normal mode, continuous conversion mode
02h 55h External reference (REFP0, REFN0), simultaneous 50Hz and 60Hz rejection, IDAC = 500µA
03h 70h IDAC1 = AIN2, IDAC2 = AIN3