SBASAX3B May   2025  – April 2026 ADS9326 , ADS9327

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics 
    6. 6.6  Electrical Characteristics: AVDD = 5V
    7. 6.7  Electrical Characteristics: AVDD = 3.3V
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
      2. 7.3.2 Reference
        1. 7.3.2.1 Internal Reference
          1. 7.3.2.1.1 Selectable Internal Reference with 5V AVDD
        2. 7.3.2.2 External Reference
        3. 7.3.2.3 External Reference With External Reference Buffer
      3. 7.3.3 Burst Sample Operation
      4. 7.3.4 ADC Transfer Function
      5. 7.3.5 Programmable Data Averaging Filter
        1. 7.3.5.1 Simple Average
          1. 7.3.5.1.1 Simple Average with Noncontinuous CONVST
        2. 7.3.5.2 Moving Average
      6. 7.3.6 Channel Averaging
      7. 7.3.7 Common-Mode Voltage Output
      8. 7.3.8 CRC on Output Data Interface
      9. 7.3.9 ADC Output Data Randomizer
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
      2. 7.4.2 Normal Operation
      3. 7.4.3 Low-Latency Mode
      4. 7.4.4 CS-CONVST Short Mode
      5. 7.4.5 Register Read Mode
      6. 7.4.6 Initialization Sequence
    5. 7.5 Programming
      1. 7.5.1  Data Interface
      2. 7.5.2  Data Frame Width
      3. 7.5.3  SPI Modes
      4. 7.5.4  CONVST Inversion
      5. 7.5.5  SCLK Echo Mode
      6. 7.5.6  Daisy-Chain Mode
      7. 7.5.7  SPI Frame Length for Register Operations
      8. 7.5.8  Register Map Lock
      9. 7.5.9  Register Write
      10. 7.5.10 Register Read
  9. 8 Register Map
    1. 8.1 Register Bank 0
    2. 8.2 Register Bank 1
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Analog 1VPP Sine-Cosine Encoder Interface
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
AVDD to GND –0.3 5.5 V
VDD_1V8 to GND –0.3 2.1 V
IOVDD to IOGND –0.3 3.7 V
AINP_A, AINM_A, AINP_B, and AINM_B to GND –0.3 AVDD + 0.3 V
REFIO to REFM –0.3 AVDD + 0.3 V
Digital inputs to IOGND –0.3 IOVDD + 0.3 V
REFM to GND –0.3 0.3 V
IOGND to GND –0.3 0.3 V
Input current to any pin except supply pins(2) –10 10 mA
Junction temperature, TJ –40 150 °C
Storage temperature, Tstg –60 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Limit pin current to 10mA or less.