SBASAX3B May   2025  – April 2026 ADS9326 , ADS9327

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics 
    6. 6.6  Electrical Characteristics: AVDD = 5V
    7. 6.7  Electrical Characteristics: AVDD = 3.3V
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
      2. 7.3.2 Reference
        1. 7.3.2.1 Internal Reference
          1. 7.3.2.1.1 Selectable Internal Reference with 5V AVDD
        2. 7.3.2.2 External Reference
        3. 7.3.2.3 External Reference With External Reference Buffer
      3. 7.3.3 Burst Sample Operation
      4. 7.3.4 ADC Transfer Function
      5. 7.3.5 Programmable Data Averaging Filter
        1. 7.3.5.1 Simple Average
          1. 7.3.5.1.1 Simple Average with Noncontinuous CONVST
        2. 7.3.5.2 Moving Average
      6. 7.3.6 Channel Averaging
      7. 7.3.7 Common-Mode Voltage Output
      8. 7.3.8 CRC on Output Data Interface
      9. 7.3.9 ADC Output Data Randomizer
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
      2. 7.4.2 Normal Operation
      3. 7.4.3 Low-Latency Mode
      4. 7.4.4 CS-CONVST Short Mode
      5. 7.4.5 Register Read Mode
      6. 7.4.6 Initialization Sequence
    5. 7.5 Programming
      1. 7.5.1  Data Interface
      2. 7.5.2  Data Frame Width
      3. 7.5.3  SPI Modes
      4. 7.5.4  CONVST Inversion
      5. 7.5.5  SCLK Echo Mode
      6. 7.5.6  Daisy-Chain Mode
      7. 7.5.7  SPI Frame Length for Register Operations
      8. 7.5.8  Register Map Lock
      9. 7.5.9  Register Write
      10. 7.5.10 Register Read
  9. Register Map
    1. 8.1 Register Bank 0
    2. 8.2 Register Bank 1
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Analog 1VPP Sine-Cosine Encoder Interface
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Switching Characteristics

at AVDD = 3V to 5.5V, VDD_1V8 = 1.75V to 1.85V, IOVDD = 1.75V to 3.3V, internal reference, and maximum throughput (unless otherwise noted); CL = 10pF; minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C
PARAMETER TEST CONDITIONS MIN MAX UNIT
CONVERSION CYCLE
tCONV ADC conversion time ADS9327 130 ns
ADS9326 200
RESET
tPU Power-up time for device 130 ms
SPI INTERFACE TIMINGS
tden_CSDO Time delay: CS falling edge to data valid on SDO 16 ns
tdz_CSDO Time delay: CS rising edge to SDO going Hi-Z 7.5 ns
tht_CKDO Hold time: SCLK launch edge to previous data valid on SDO 7.6 ns
td_CKDO Time delay: SCLK launch edge to corresponding data valid on SDO 17 ns
tECHO Time delay: SCLK launch edge to SCLK echo output on D0 in SCLK Echo mode td_CKDO – 2 ns