SBOS092B June   1998  – January 2025 XTR106

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Linearization
      2. 6.3.2 Reverse-Voltage Protection
      3. 6.3.3 Overvoltage Surge Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 External Transistor
      2. 7.1.2 Loop Power Supply
      3. 7.1.3 Bridge Balance
      4. 7.1.4 Underscale Current
      5. 7.1.5 Low-Impedance Bridges
      6. 7.1.6 Other Sensor Types
      7. 7.1.7 Radio Frequency Interference
      8. 7.1.8 Error Analysis
    2. 7.2 Typical Applications
    3. 7.3 Layout
    4. 7.4 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

8 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.