SBOS092B June   1998  – January 2025 XTR106

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Linearization
      2. 6.3.2 Reverse-Voltage Protection
      3. 6.3.3 Overvoltage Surge Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 External Transistor
      2. 7.1.2 Loop Power Supply
      3. 7.1.3 Bridge Balance
      4. 7.1.4 Underscale Current
      5. 7.1.5 Low-Impedance Bridges
      6. 7.1.6 Other Sensor Types
      7. 7.1.7 Radio Frequency Interference
      8. 7.1.8 Error Analysis
    2. 7.2 Typical Applications
    3. 7.3 Layout
    4. 7.4 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision A (November 2003) to Revision B (January 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Pin Configuration and Functions, Recommended Operating Conditions, Thermal Information, Electrical Characteristics, Detailed Description, Functional Block Diagram, Application and Implementation, Typical Applications, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Modified end equipments in Applications Go
  • Moved operating and storage temperature parameters from Electrical Characteristics to Absolute Maximum Ratings Go
  • Changed minimum operating temperature from −55°C to −40°C in Absolute Maximum Ratings Go
  • Moved specified temperature and power-supply parameters from Electrical Characteristics to Recommended Operating Conditions Go
  • Deleted thermal resistance, θ JA parameters in Electrical Characteristics and replaced with detailed thermal model parameters in Thermal Information Go
  • Added footnote regarding the use of the box method for the voltage references accuracy vs temperature specification in Electrical Characteristics Go
  • Changed typical VREG accuracy vs temperature specification from ±0.3mV/°C to ±0.5mV/°C in Electrical Characteristics Go
  • Deleted Input Voltage, Input Current, and Zero Output Current Noise Density vs Frequency plot and replaced with Figure 5-13, Input Voltage Noise Density vs Frequency, and Figure 5-14, Zero Output Current Noise Density vs Frequency Go
  • Updated Figure 5-20, Reference Voltage Deviation vs Temperature Go
  • Changed description of maximum loop-supply voltage to specified absolute maximum rating in Overvoltage Surge Protection Go
  • Updated suggested transistor part numbers in Figure 7-1, Basic Bridge Measurement Circuit with Linearization Go