SBOU319A November   2024  – June 2025 HDC3120

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 HDC3120EVM Specifications
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Setup and Interface
      1. 2.1.1 Setup Overview
      2. 2.1.2 Connecting Board Power and Ground
      3. 2.1.3 Connecting to the HDC3120 and Comparator Outputs
      4. 2.1.4 Temperature
      5. 2.1.5 Relative Humidity (RH)
      6. 2.1.6 HDC3120EVM Buttons
        1. 2.1.6.1 Reset Button (SW1)
        2. 2.1.6.2 Heater Enable Switch (S2)
    2. 2.2 Comparator Function
  9. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
      1. 3.2.1 Layout Overview
      2. 3.2.2 Layout Guidelines
    3. 3.3 Bill of Materials (BOM)
  10. 4Additional Information
    1. 4.1 Trademarks
  11. 5Related Documentation
  12. 6Revision History

3.2.1 Layout Overview

The HDC3120EVM is a four-layer PCB appropriate for analog-signal integrity and thermal performance. The design includes a cutout around the HDC3120 device to reduce self-heating effects and improve measurement accuracy.

  • Layer 1 (Top): Carries general analog signal traces
  • Layer 2 (Internal): Dedicated ground (GND) copper plane
  • Layer 3 (Internal): Dedicated VDD copper plane
  • Layer 4 (Bottom): Carries additional analog signal routing