12 Revision History
Changes from Revision N (May 2025) to Revision O (June 2025)
- Separated relevant DBV and DCK specifications from other
packagesGo
Changes from Revision M (August 2022) to Revision N (May 2025)
- ABS max supply voltage changedGo
- Updated thermal parameters for DBV and DCKGo
- rrange updatedGo
- Updated enable timing for 85C 1.8V and 125C 5V conditionsGo
- Updated disable timing for 85C 5V and 125C 3.3V, 5V conditionsGo
- Updated THD test conditions and 1.65V specificationGo
Changes from Revision L (May 2017) to Revision M (August 2022)
- Updated the numbering format for tables, figures, and
cross-references throughout the documentGo
- Updated the Pin Configuration and Functions
sectionGo
- Updated the equation in the Detailed Design Procedure
sectionGo
Changes from Revision K (January 2017) to Revision L (May 2017)
- Deleted Feature "Useful for Both Analog and Digital Applications" Go
- Deleted Feature "High Degree of Linearity" Go
- Changed the first sentence of the Description From: "This single-pole double-throw (SPDT)..." To: "This single channel single pole double-throw (SPDT)..." Go
- Added the X2SON (DTB) package to the Device Information
Go
- Added the X2SON (DTB) Package, to the Pin Configuration and
Functions
Go
- Changed Figure 6-2, From: SW1 = VIL to SW1 = VIH, From: SW2 = VIH to: SW2 = VIL
Go
- Changed Figure 6-5
Go
- Added a series 50-Ω resistor on B1 in Figure 6-6
Go
- Changed Figure 6-7
Go
Changes from Revision J (June 2016) to Revision K (January 2017)
- Added new applications to Applications section Go
Changes from Revision I (June 2015) to Revision J (June 2016)
- Deleted 200V Machine Model (A115-A) from Features
Go
- Changed Feature From: "Operating Frequency Typically 300MHz at Room
Temperature" To: "Operating Frequency Typically 340MHz at Room
Temperature"Go
- Updated Device Information tableGo
- Updated pinout images for all PackagesGo
- Added Receiving Notification of Documentation Updates
sectionGo
Changes from Revision H (May 2012) to Revision I (June 2015)
- Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
- Updated Features.Go
Changes from Revision G (September 2011) to Revision H (May 2012)
- Changed YZP with correct pin labels. Go