SCPS286B July   2025  – July 2026 TPLD2001

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1.     7
    2. 5.1 Absolute Maximum Ratings
    3. 5.2 ESD Ratings
    4. 5.3 Recommended Operating Conditions
    5. 5.4 Thermal Information
    6. 5.5 Electrical Characteristics
    7. 5.6 Supply Current Characteristics
    8. 5.7 Switching Characteristics
    9. 5.8 I2C Bus Timing Requirements
    10. 5.9 SPI Timing Requirements
  7. 6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  I/O Pins
        1. 8.3.1.1 Input Modes
        2. 8.3.1.2 Output Modes
        3. 8.3.1.3 Pull-Up or Pull-Down Resistors
      2. 8.3.2  Connection Mux
      3. 8.3.3  Configurable Use Logic Blocks
        1. 8.3.3.1 2-Bit LUT or D Flip-Flop/Latch macro-cell
          1. 8.3.3.1.1 2-Bit LUT
          2. 8.3.3.1.2 D Flip-Flop/Latch
        2. 8.3.3.2 2-Bit LUT or Pattern Generator macro-cell
          1. 8.3.3.2.1 2-Bit LUT
          2. 8.3.3.2.2 Pattern Generator
        3. 8.3.3.3 3-Bit LUT or D Flip-Flop/Latch With Reset/Set Macro-Cell
          1. 8.3.3.3.1 3-bit LUT
          2. 8.3.3.3.2 D Flip-Flop/Latch with Reset/Set
        4. 8.3.3.4 3-Bit LUT or D Flip-Flop/Latch or Shift Register macro-cell
          1. 8.3.3.4.1 3-bit LUT
          2. 8.3.3.4.2 D Flip-Flop/Latch with Reset/Set
          3. 8.3.3.4.3 8-bit Shift Register
        5. 8.3.3.5 4-Bit LUT or D Flip-Flop/Latch with Reset/Set Macro-Cell
          1. 8.3.3.5.1 4-bit LUT
          2. 8.3.3.5.2 D Flip-Flop/Latch with Reset/Set
      4. 8.3.4  Configurable Logic and Timing Blocks
        1. 8.3.4.1 3-bit LUT
        2. 8.3.4.2 D Flip-Flop/Latch with Reset/Set
        3. 8.3.4.3 Counters/Delay Generators (CNT/DLY)
          1. 8.3.4.3.1 Delay Mode
          2. 8.3.4.3.2 Reset Counter Mode
          3. 8.3.4.3.3 One-Shot Mode
          4. 8.3.4.3.4 Frequency Detector Mode
          5. 8.3.4.3.5 Edge Detector Mode
          6. 8.3.4.3.6 Delayed Edge Detector Mode
        4. 8.3.4.4 LUT/DFF + CNT modes
      5. 8.3.5  Programmable Deglitch Filter or Edge Detector
      6. 8.3.6  Deglitch Filter or Edge Detector
      7. 8.3.7  State Machine (SM)
        1. 8.3.7.1 State Machine Inputs
        2. 8.3.7.2 State Machine Outputs
        3. 8.3.7.3 Configuring the State Machine
        4. 8.3.7.4 State Machine Timing Considerations
      8. 8.3.8  8-Bit Counters/Delay Generators/Finite State Machines
      9. 8.3.9  PWM Generators
      10. 8.3.10 Watchdog Timer
      11. 8.3.11 Analog Comparators
        1. 8.3.11.1 Discrete Analog Comparator (ACMP)
        2. 8.3.11.2 Multi-channel Analog Comparator (McACMP)
      12. 8.3.12 Voltage Reference (VREF)
      13.      70
      14. 8.3.13 Analog Temperature Sensor (TS)
      15. 8.3.14 Analog Multiplexer (AMUX)
      16. 8.3.15 Oscillators
        1. 8.3.15.1 2kHz Fixed Frequency Oscillator
        2. 8.3.15.2 2MHz Fixed Frequency Oscillator
        3. 8.3.15.3 25MHz Fixed Frequency Oscillator
        4. 8.3.15.4 Oscillator Power Modes
      17. 8.3.16 Serial Communications
        1. 8.3.16.1 I2C Mode
        2. 8.3.16.2 SPI Mode
        3. 8.3.16.3 Virtual I/Os
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Power Supply Control Modes
      3. 8.4.3 Protection Features
        1. 8.4.3.1 Device Read/Write Lock
        2. 8.4.3.2 OTP Cyclic Redundancy Check (CRC)
      4. 8.4.4 Programming
        1. 8.4.4.1 Selectable I2C/SPI
        2. 8.4.4.2 Configuration Memory and One-Time Programmable Memory Programming
        3. 8.4.4.3 Intel HEX File Format
  10. 9  TPLD2001 Registers
    1. 9.1 TPLD2001_User Registers
    2. 9.2 TPLD2001_Cfg_0 Registers
    3. 9.3 TPLD2001_Cfg_1 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Power Considerations
        2. 10.2.1.2 Input Considerations
        3. 10.2.1.3 Output Considerations
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

10.2.1.1 Power Considerations

Ensure the desired supply voltage is within the range specified in the Recommended Operating Conditions. The supply voltage sets the device's electrical characteristics of the device as described in the Electrical Characteristics section.

The positive voltage supply must be capable of sourcing current equal to the total current to be sourced by all outputs of the TPLD2001 plus the maximum static supply current, ICC, listed in the Electrical Characteristics, and any transient current required for switching. The device can only source as much current that is provided by the positive supply source. Ensure the maximum total current through VCC listed in the Absolute Maximum Ratings is not exceeded.

The ground must be capable of sinking current equal to the total current to be sunk by all outputs of the TPLD2001 plus the maximum supply current, ICC, listed in the Electrical Characteristics, and any transient current required for switching. The logic device can only sink as much current that can be sunk into its ground connection. Ensure the maximum total current through GND listed in the Absolute Maximum Ratings is not exceeded.

The TPLD2001 can drive a load with a total capacitance less than or equal to 15pF while still meeting all of the data sheet specifications. Larger capacitive loads can be applied; however, it is not recommended to exceed 15pF.

The TPLD2001 can drive a load with total resistance described by RL ≥ VO / IO, with the output voltage and current defined in the Electrical Characteristics table with VOH andVOL. When outputting in the HIGH state, the output voltage in the equation is defined as the difference between the measured output voltage and the supply voltage at the VCC pin.

Total power consumption can be calculated using the information provided in CMOS Power Consumption and Cpd Calculation.

Thermal increase can be calculated using the information provided in Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices.

CAUTION: The maximum junction temperature, TJ(max) listed in the Absolute Maximum Ratings, is an additional limitation to prevent damage to the device. Do not violate any values listed in the Absolute Maximum Ratings. These limits are provided to prevent damage to the device.