SCPS299B May   2025  – July 2026 TXE8124-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 SPI Bus Timing Requirements
    8. 5.8 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 I/O Port
      2. 7.3.2 Interrupt Output (INT)
      3. 7.3.3 Reset Input (RESET)
      4. 7.3.4 Bus Hold
      5. 7.3.5 Fail-safe Mode
      6. 7.3.6 Software Reset Call
      7. 7.3.7 Daisy Chain
      8. 7.3.8 Multi Port
      9. 7.3.9 Feature Register Mapping
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 SPI
      2. 7.5.2 SPI Data Format
      3. 7.5.3 Burst Mode
      4. 7.5.4 SPI Write
      5. 7.5.5 SPI Read
      6. 7.5.6 SPI Daisy Chain
    6. 7.6 TXE8124 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-On Reset Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002, all pins(1) ±2000 V
Charged device model (CDM), per AEC Q100-011, all pins ±1000
(1)
AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.