SDAA044 September   2025 AM623 , AM625 , AM62L

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 Overview of AM62x vs AM62Lx
  6. 3 Power Architecture and PMIC Considerations
  7. 4 IO Voltage Domains and Signal Levels
    1. 4.1 Dual-Voltage vs. 1.8V-Only IO Banks
    2. 4.2 Buffer Types and Fail-Safe IOs
  8. 5 Peripheral Interface Changes
    1. 5.1 Memory Interfaces
    2. 5.2 Connectivity
    3. 5.3 Media and Display Interfaces
    4. 5.4 Analog and Other Interfaces
  9. 6 Boot Configuration and Reset Changes
  10. 7 Package and Layout Considerations
    1. 7.1 BGA Package Options
    2. 7.2 Thermal and Power Dissipation
  11. 8 Summary
  12. 9 Terminology and Acronyms
  13. 10References

Abstract

This application note serves as a hardware migration guide overview for moving a design from the AM62x (AM625x, AM623x) family of TI SitaraTM processors to the AM62Lx family of TI SitaraTM processors, or moving a design from the AM62Lx family of processors to the AM62x family of processors. This highlights board-level design differences associated with power rails, IO voltages, peripheral interfaces, boot configurations, and package options.

The AM62x family of processors provides higher performance capabilities than the AM62Lx family of processors along with additional flexibility of powering the device from a single 0.85V core power domain or separate 0.75V and 0.85V core power domains. The single 0.85V core power domain option provides maximum performance, while the separate core power domain option provides lower power consumption with a slight reduction in performance and the additional cost of implementing another core power domain. These core power options provide the system designer with a trade-off between device performance and power consumption.

The AM62Lx family of processors has characteristics that enable a simpler, lower-cost design by only requiring a single 0.75V core power domain, supporting RTC Only and RTC + IO + DDR low-power states, and streamlining SD-card power path with an integrated LDO, SDIO_LDO, which simplifies the system design and enables a lower cost Bill of Material (BOM).