SLAAE76C March 2023 – May 2025 MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G3105 , MSPM0G3106 , MSPM0G3107 , MSPM0G3505 , MSPM0G3506 , MSPM0G3507
A right angle in a trace can cause more radiation. The capacitance increases in the region of the corner and the characteristic impedance changes. This impedance change causes reflections. Avoid right-angle bends in a trace and try to route them with at least two 45° corners. To minimize any impedance change, the best routing is a round bend, as shown in Figure 9-3.
Figure 9-3 Poor and Correct Way of Bending Traces in Right AngleTo minimize crosstalk, not only between two signals on one layer but also between adjacent layers, route them 90° to each other. More complex boards need to use vias while routing; however, care must be taken when using vias as these add additional inductance and capacitance, and reflections occur due to the change in the characteristic impedance. Vias also increase the trace length. When using differential signals, use vias in both traces or compensate the delay in the other trace as well.
For signal traces, observe the impact of high-frequency pulse signals, especially on relatively small analog signals (like sensor signals). Too many crossovers couple the electromagnetic noise of the high-frequency signal to the analog signal, which results in a low signal-to-noise ratio of the signal and affect the signal quality. Therefore, avoid crossing when designing. But, if there is indeed an unavoidable intersection, then TI recommends to intersect vertically to minimize the interference of electromagnetic noise. Figure 9-4 shows how to reduce this noise.
Figure 9-4 Poor and Correct Cross Traces for Analog and High-Frequency Signals