SLAAET8A April   2025  – December 2025 MSPM0C1103 , MSPM0C1103-Q1 , MSPM0C1104 , MSPM0C1104-Q1 , MSPM0C1105 , MSPM0C1106 , MSPM0C1106-Q1 , MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G1518 , MSPM0G1519 , MSPM0G3105 , MSPM0G3105-Q1 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3505-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3518 , MSPM0G3518-Q1 , MSPM0G3519 , MSPM0G3519-Q1 , MSPM0G3529-Q1 , MSPM0H3216 , MSPM0H3216-Q1 , MSPM0L1105 , MSPM0L1106 , MSPM0L1116 , MSPM0L1117 , MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2227 , MSPM0L2227-Q1 , MSPM0L2228 , MSPM0L2228-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2EMC and EMC Standards
    1. 2.1 EMC
      1. 2.1.1 EMS
      2. 2.1.2 EMI
    2. 2.2 EMC Standards
      1. 2.2.1 EMC Standards Category
    3. 2.3 EMC and IC Electrical Reliability in TI
  6. 3EMC Improvement Guidelines Summary
    1. 3.1 PCB Design Guidelines
    2. 3.2 Firmware Guidelines
  7. 4EMC Improvement Features on MSPM0
    1. 4.1 Susceptibility Protection Features
      1. 4.1.1 POR and BOR
      2. 4.1.2 NMI and Hard Fault
      3. 4.1.3 I/O ESD and Settings
    2. 4.2 Emission Reduction Features
      1. 4.2.1 Clock Source
      2. 4.2.2 Power Modes
      3. 4.2.3 Package
  8. 5Analysis for EMS Test
    1. 5.1 Root Cause Analysis
      1. 5.1.1 Permanent Damage
      2. 5.1.2 Recoverable Malfunction
    2. 5.2 Debug Flow
  9. 6Analysis for EMI Test
    1. 6.1 Root Cause Analysis
      1. 6.1.1 Power Line
      2. 6.1.2 External Vcore
    2. 6.2 Debug Flow
  10. 7Summary
  11. 8References
  12. 9Revision History

3.2 Firmware Guidelines

Here are the MSPM0 related software configuration guidelines.

Table 3-3 MSPM0 Configuration Guidelines
TechniqueEMS CoverageSuggestions
BOREMSSelect higher BOR level if needed for data saving.
I/O SettingsKeep I/O setting to be default or output low. Need more protection for open-drain IOs if used.
Clock SourceEMIControl the usage of clock.
Power ModeChoose a valid power mode when running MCU.
PackageChoose the smaller and thinner package.

Here are the common firmware guidelines to improved EMS performance, which are also covered by applicable standards.

Table 3-4 Common Firmware Guidelines
TechniqueKey ImplementationApplicable StandardsStandard Requirements
Watchdog and time controlUse independent or window watchdogs; refresh in main loopIEC 60730, ISO 26262, IEC 61508Mandate watchdog usage for fault detection and system recovery. ASIL D requires redundancy.
Securing unused memoryFill unused Flash or SRAM with valid instructions (for example, fault-handling routines)IEC 60730, ISO 26262Require program counter integrity checks and software robustness.
Input filtering and comparisonMultistage checks with averaging or debouncingIEC 60730Emphasize noise filtering for sensor reliability and input validation.
Unused interrupt managementRedirect unused interrupt vectors to a safe-state handlerIEC 61508, IEC 60730Makes sure of controlled system states by handling all interrupt sources.
ADC averagingMultiple conversions with outlier rejectionIEC 60730, ISO 26262Requires periodic ADC self-tests and redundancy for critical data.
Register reprogramming and checksPeriodic reconfiguration and verification of critical registersIEC 61508, IEC 60730Mandates cyclic self-tests for configuration integrity.
Redundant data storageDual storage with CRC, ECC; hash validationIEC 60730, ISO 26262Requires fault tolerance by redundancy; ASIL D enforces dual-channel redundancy.