SLAAET8A April   2025  – December 2025 MSPM0C1103 , MSPM0C1103-Q1 , MSPM0C1104 , MSPM0C1104-Q1 , MSPM0C1105 , MSPM0C1106 , MSPM0C1106-Q1 , MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G1518 , MSPM0G1519 , MSPM0G3105 , MSPM0G3105-Q1 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3505-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3518 , MSPM0G3518-Q1 , MSPM0G3519 , MSPM0G3519-Q1 , MSPM0G3529-Q1 , MSPM0H3216 , MSPM0H3216-Q1 , MSPM0L1105 , MSPM0L1106 , MSPM0L1116 , MSPM0L1117 , MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2227 , MSPM0L2227-Q1 , MSPM0L2228 , MSPM0L2228-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2EMC and EMC Standards
    1. 2.1 EMC
      1. 2.1.1 EMS
      2. 2.1.2 EMI
    2. 2.2 EMC Standards
      1. 2.2.1 EMC Standards Category
    3. 2.3 EMC and IC Electrical Reliability in TI
  6. 3EMC Improvement Guidelines Summary
    1. 3.1 PCB Design Guidelines
    2. 3.2 Firmware Guidelines
  7. 4EMC Improvement Features on MSPM0
    1. 4.1 Susceptibility Protection Features
      1. 4.1.1 POR and BOR
      2. 4.1.2 NMI and Hard Fault
      3. 4.1.3 I/O ESD and Settings
    2. 4.2 Emission Reduction Features
      1. 4.2.1 Clock Source
      2. 4.2.2 Power Modes
      3. 4.2.3 Package
  8. 5Analysis for EMS Test
    1. 5.1 Root Cause Analysis
      1. 5.1.1 Permanent Damage
      2. 5.1.2 Recoverable Malfunction
    2. 5.2 Debug Flow
  9. 6Analysis for EMI Test
    1. 6.1 Root Cause Analysis
      1. 6.1.1 Power Line
      2. 6.1.2 External Vcore
    2. 6.2 Debug Flow
  10. 7Summary
  11. 8References
  12. 9Revision History

2.3 EMC and IC Electrical Reliability in TI

IC electrical reliability is a part of the IC reliability. The related standards are HBM, CBM and latch up, which are released by JEDEC and ESDA, aim to verify long-term performance under stress.

IC Reliability StandardsFigure 2-2 IC Reliability Standards

Some users confuse reliability with EMC, especially on ESD ratings. For IC electrical reliability, the related standards are JS-001 (HBM) and JS-002 (CBM). For EMC, the related standards are IEC 61000-4-2 and IEC 61967. These standards belong to two different standard categories. Table 2-3 gives an overview about the differences between EMC and IC electrical reliability.

Table 2-3 EMC and Electrical Reliability Comparison
Aspect IC EMC Testing IC Electrical Reliability Testing

Primary objective

Check the electromagnetic compatibility of a system under an electrical environment.

Verifies long-term stability and lifespan of ICs under electrical stress, preventing performance degradation or physical failure.
Noise injection The IC-based system IC

Test focus and example

System-level electromagnetic interactions.

Example - ESD immunity: Validate system recovery from ESD events during usage.

IC endurance for electrical stress.

Example - HBM, CBM: Tests IC tolerance to ESD events during manufacturing and assembly.

Optimization

Yes. Improved with HW/SW co-design.

No. Require IC redesign or silicon revisions.

SW Dependency

Yes. Firmware-dependent.

No

Failure impact

System-level malfunctions

Irreversible chip-level damage

In the IC design flow, the primary focus is on verifying reliability through methodologies that address physical degradation, manufacturing variability, and operational stresses. While EMC is not a direct consideration in traditional IC design frameworks, the scope is an IC-based system and not purely the IC. However, on-chip components like ESD structures can still provide foundational support for EMC improvements. For the related EMC improvement features on MSPM0, refer to Section 4.

For EMC testing, TI provides an EU Declaration of Conformity for every EVM with limited ICs on board, which shows these EVM boards can meet the EN61326-1:2013 requirement. Here is an example: LP-MSPM0G3507 EU RoHS Declaration of Conformity (DoC). For IC Reliability testing, TI provide qualifications for every orderable part number devices. Under Qualification Summary, users can find data for every typical IC part number as shown in Figure 2-3.

IC Reliability EntranceFigure 2-3 IC Reliability Entrance

For more about IC electrical reliability, refer to the Latch-Up, ESD, and Other Phenomena application report and Latch-Up white paper.