SLASFB9 June   2025 MSPM0H3216

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2.     9
    3. 6.2 Signal Descriptions
      1.      11
      2.      12
      3.      13
      4.      14
      5.      15
      6.      16
      7.      17
      8.      18
      9.      19
      10.      20
    4. 6.3 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3   Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 High Frequency Crystal/Clock
      4. 7.9.4 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 ADC
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
      3. 7.11.3 Linearity Parameters
      4. 7.11.4 Typical Connection Diagram
    12. 7.12 Temperature Sensor
    13. 7.13 VREF
      1. 7.13.1 Voltage Characteristics
      2. 7.13.2 Electrical Characteristics
    14. 7.14 I2C
      1. 7.14.1 I2C Characteristics
      2. 7.14.2 I2C Filter
      3. 7.14.3 I2C Timing Diagram
    15. 7.15 SPI
      1. 7.15.1 SPI
      2. 7.15.2 SPI Timing Diagram
    16. 7.16 UART
    17. 7.17 TIMx
    18. 7.18 Windowed Watchdog Characteristics
    19. 7.19 Emulation and Debug
      1. 7.19.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0H321x)
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 CRC
    17. 8.17 UART
    18. 8.18 SPI
    19. 8.19 I2C
    20. 8.20 Low-Frequency Sub System (LFSS)
    21. 8.21 RTC_B
    22. 8.22 IWDT_B
    23. 8.23 WWDT
    24. 8.24 Timers (TIMx)
    25. 8.25 Device Analog Connections
    26. 8.26 Input/Output Diagrams
    27. 8.27 Serial Wire Debug Interface
    28. 8.28 Device Factory Constants
    29. 8.29 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

8.21 RTC_B

The RTC_B instance of the real-time clock operates off of a 32kHz input clock source (typically a low frequency crystal) and provides a time base to the application with multiple options for interrupts to the CPU. The RTC_B provides common key features in relation to the Low-Frequency Sub System (LFSS).

Common key features of the RTC_B include:

  • Counters for seconds, minutes, hours, day of the week, day of the month, month, and year
  • Binary or BCD format
  • Leap-year handling
  • One customizable alarm interrupt based on minute, hour, day of the week, and day of the month
  • Interval alarm interrupt to wake every minute, every hour, at midnight, or at noon
  • Interval alarm interrupt providing periodic wake-up at 4096, 2048, 1024, 512, 256, or 128 Hz
  • Interval alarm interrupt providing periodic wake-up at 64, 32, 16, 8, 4, 2, 1, and 0.5 Hz
  • Calibration for crystal offset error (up to +/- 240ppm)
  • Compensation for temperature drift (up to +/- 240ppm)
  • RTC clock output to pin for calibration

RTC_B Key Features#GUID-F4D4E874-DA3D-41EB-A4B9-12F92927C00E shows the RTC features supported in this device.

Table 8-10 RTC_B Key Features

RTC Features

RTC_B

Power enable register

-

Real-time clock and calendar mode providing seconds, minutes, hours, day of week, day of month, and year

Yes

Selectable binary or binary-coded decimal (BCD) format

Yes

Leap-year correction (valid for year 1901 through 2099)

Yes

Two customizable calendar alarm interrupts based on minute, hour, day of the week, and day of the month

Yes

Interval alarm interrupt to wake every minute, every hour, at midnight, or at noon

Yes

Periodic interrupt to wake at 4096, 2048, 1024, 512, 256, or 128Hz

Yes

Periodic interrupt to wake at 64, 32, 16, 8, 4, 2, 1, and 0.5Hz

Yes

Interrupt capability down to STANDBY mode with STOPCLKSTBY

Yes

Calibration for crystal offset error and crystal temperature drift (up to ±240 ppm total)

Yes

RTC clock output to pin for calibration (GPIO)

Yes

RTC clock output to pin for calibration (TIO)

-

Three -bit prescaler for heartbeat function with interrupt generation

-

RTC external clock selection of untrimmed 32kHz, trimmed 512Hz, 256Hz or 1Hz

-

RTC time stamp capture upon detection of a timer stamp event, including:

  • TIO event

  • VDD fail event

-

RTC counter lock function

-

For more details, see the RTC chapter of the MSPM0 H-Series 32MHz Microcontrollers Technical Reference Manual.