SLASFC9A December   2024  – June 2025 MSPM0L1116 , MSPM0L1117

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 I2C
      1. 7.15.1 I2C Characteristics
      2. 7.15.2 I2C Filter
      3. 7.15.3 I2C Timing Diagram
    16. 7.16 SPI
      1. 7.16.1 SPI
      2. 7.16.2 SPI Timing Diagram
    17. 7.17 UART
    18. 7.18 TIMx
    19. 7.19 TRNG Electrical Characteristics
    20. 7.20 TRNG Switching Characteristics
    21. 7.21 Emulation and Debug
      1. 7.21.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 Security
    17. 8.17 TRNG
    18. 8.18 AESADV
    19. 8.19 Keystore
    20. 8.20 CRC-P
    21. 8.21 UART
    22. 8.22 I2C
    23. 8.23 SPI
    24. 8.24 Low-Frequency Sub System (LFSS)
    25. 8.25 RTC_B
    26. 8.26 IWDT_B
    27. 8.27 WWDT
    28. 8.28 Timers (TIMx)
    29. 8.29 Device Analog Connections
    30. 8.30 Input/Output Diagrams
    31. 8.31 Serial Wire Debug Interface
    32. 8.32 Bootstrap Loader (BSL)
    33. 8.33 Device Factory Constants
    34. 8.34 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

3 Description

MSPM0L111x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm®Cortex®-M0+ core platform operating at up to 32MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration and excellent low-power current consumption. The MCUs also support extended temperature ranges from -40°C to 125°C and operate with supply voltages ranging from 1.62V to 3.6V.

The device has up to 128KB of embedded flash memory with built-in error correction code (ECC) and up to 16KB SRAM. The flash memory is organized into two main banks to support field firmware updates, with address swap support provided between the two main banks.

Flexible cybersecurity enablers can be used to support secure boot, secure in-field firmware updates, IP protection (execute-only memory), key storage, and more. Hardware acceleration is provided for a variety of AES symmetric cipher modes, as well as a TRNG entropy source. The cybersecurity architecture is pending Arm® PSA Level 1 certification.

These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16-bit/32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68Msps ADC with configurable internal voltage reference and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced control timer and two 16-bit general purpose timers, one general purpose timer with Quadrature Enabled Input, windowed and independent watchdog timer, and a variety of communication peripherals including one I2C, one SPI, and two UARTs (one with support for LIN protocol).

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers to find the MCU that meets their project's needs. The architecture combined with extensive low-power modes are optimized to achieve extended battery life in portable measurement applications.

MSPM0L111x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ development kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 L-Series 32MHz Microcontrollers Technical Reference Manual.

CAUTION:

System-level ESD protection must be applied in compliance with the device-level ESD specification to prevent electrical overstress or disturbing of data or code memory. See MSP430™ System-Level ESD Considerations for more information; the principles in this application note are applicable to MSPM0 MCUs.

Device Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)

MSPM0L1116SRGER

RGE (VQFN, 24)

 4mm x 4mm

MSPM0L1117SRGER

MSPM0L1116SRHBR

RHB (VQFN, 32)

5mm x 5mm

MSPM0L1117SRHBR

MSPM0L1116SRGZR

RGZ (VQFN, 48)

7mm x 7mm

MSPM0L1117SRGZR

MSPM0L1116SPTR

PT (LQFP, 48)

9mm x 9mm

MSPM0L1117SPTR
(2) The package size (length x width) is a nominal value and includes pins, where applicable.