SLASFJ6B July   2025  – January 2026 MSPM0C1105 , MSPM0C1106

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 Low Frequency Crystal/Clock
      4. 7.9.4 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Electrical Characteristics
      2. 7.14.2 Voltage Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 I2C
      1. 7.16.1 I2C Characteristics
      2. 7.16.2 I2C Filter
      3. 7.16.3 I2C Timing Diagram
    17. 7.17 SPI
      1. 7.17.1 SPI
      2. 7.17.2 SPI Timing Diagram
    18. 7.18 UART
    19. 7.19 TIMx
    20. 7.20 Emulation and Debug
      1. 7.20.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 Low-Frequency Sub System (LFSS)
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 Security
    19. 8.19 CRC
    20. 8.20 UART
    21. 8.21 I2C
    22. 8.22 SPI
    23. 8.23 IWDT
    24. 8.24 WWDT
    25. 8.25 RTC_B
    26. 8.26 Timers (TIMx)
    27. 8.27 Device Analog Connections
    28. 8.28 Input/Output Diagrams
    29. 8.29 Serial Wire Debug Interface
    30. 8.30 DEBUGSS
    31. 8.31 Device Factory Constants
    32. 8.32 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) PACKAGE VALUE UNIT
RθJA Junction-to-ambient thermal resistance LQFP-48 (PT) 78.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.1 °C/W
RθJB Junction-to-board thermal resistance 50.7 °C/W
ΨJT Junction-to-top characterization parameter 3.5 °C/W
ΨJB Junction-to-board characterization parameter 50.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-48 (RGZ) 34.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25.4 °C/W
RθJB Junction-to-board thermal resistance 17.5 °C/W
ΨJT Junction-to-top characterization parameter 1.6 °C/W
ΨJB Junction-to-board characterization parameter 17.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.0 °C/W
RθJA Junction-to-ambient thermal resistance NFBGA-48 (ZCM) 101.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.1 °C/W
RθJB Junction-to-board thermal resistance 62.2 °C/W
ΨJT Junction-to-top characterization parameter 1.8 °C/W
ΨJB Junction-to-board characterization parameter 62.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-32 (RHB) 38.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.1 °C/W
RθJB Junction-to-board thermal resistance 18.7 °C/W
ΨJT Junction-to-top characterization parameter 1.6 °C/W
ΨJB Junction-to-board characterization parameter 18.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.1 °C/W
RθJA Junction-to-ambient thermal resistance VSSOP-28 (DGS28) 80.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 39.9 °C/W
RθJB Junction-to-board thermal resistance 42.6 °C/W
ΨJT Junction-to-top characterization parameter 3.5 °C/W
ΨJB Junction-to-board characterization parameter 42.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-24 (RGE) 47.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 40.4 °C/W
RθJB Junction-to-board thermal resistance 23.7 °C/W
ΨJT Junction-to-top characterization parameter 2.4 °C/W
ΨJB Junction-to-board characterization parameter 23.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.3 °C/W
RθJA Junction-to-ambient thermal resistance VSSOP-20 (DGS20) 92.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.5 °C/W
RθJB Junction-to-board thermal resistance 49.6 °C/W
ΨJT Junction-to-top characterization parameter 1.3 °C/W
ΨJB Junction-to-board characterization parameter 49.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance WQFN-20 (RUK) 49.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.9 °C/W
RθJB Junction-to-board thermal resistance 23.6 °C/W
ΨJT Junction-to-top characterization parameter 1.4 °C/W
ΨJB Junction-to-board characterization parameter 23.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.