SLDS204D October 2014 – February 2025 PGA300
PRODUCTION DATA
| THERMAL METRIC(1) | PGA300 | UNIT | |
|---|---|---|---|
| RHH (VQFN) | |||
| 36 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 30.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 16.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 5.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 5.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.7 | °C/W |