SLLA414A August   2025  – January 2026 BQ24392 , HD3SS212 , HD3SS213 , HD3SS214 , HD3SS215 , HD3SS3202 , HD3SS3212 , HD3SS3220 , HD3SS3411 , HD3SS3412 , HD3SS3415 , HD3SS460 , SN65DP149 , SN65DP159 , SN75DP130 , SN75DP149 , SN75DP159 , TMDS171 , TMDS181 , TMUXHS4212 , TS3DV642 , TS3USB221 , TS3USB221A , TS3USB221E , TS3USB30 , TS3USB3000 , TS3USB3031 , TS3USB30E , TS3USB31 , TS3USB31E , TS3USB3200 , TS5USBA224 , TS5USBC400 , TS5USBC402 , TS5USBC41 , TUSB1002 , TUSB1002A , TUSB1042I , TUSB211 , TUSB212 , TUSB213 , TUSB214 , TUSB215 , TUSB4020BI , TUSB4041I , TUSB501 , TUSB522P , TUSB542 , TUSB551 , TUSB8020B , TUSB8041 , TUSB8041A , TUSB8042 , TUSB8043 , TUSB8044

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Protocol Specific Layout Guidelines
    1. 2.1 USB 2.0
    2. 2.2 USB 4.0 3.2 Gen1/Gen2
    3. 2.3 HDMI
    4. 2.4 DisplayPort
  6. 3General High-Speed Signal Routing
    1. 3.1 Trace Impedance
    2. 3.2 High-Speed Signal Trace Lengths
    3. 3.3 High-Speed Signal Trace Length Matching
    4. 3.4 Return Path
    5. 3.5 High-Speed Signal Reference Planes
  7. 4High-Speed Differential Signal Routing
    1. 4.1  Differential Signal Spacing
    2. 4.2  Additional High-Speed Differential Signal Rules
    3. 4.3  Symmetry in the Differential Pairs Reference
    4. 4.4  Connectors and Receptacles
    5. 4.5  Via Discontinuity Mitigation
    6. 4.6  Back-Drill Stubs
    7. 4.7  Trace Stubs
    8. 4.8  Increase Via Anti-Pad Diameter
    9. 4.9  Equalize Via Count
    10. 4.10 Surface-Mount Device Pad Discontinuity Mitigation
    11. 4.11 Signal Bending
    12. 4.12 Suggested PCB Stackups
    13. 4.13 ESD/EMI Considerations
    14. 4.14 ESD/EMI Layout Rules
  8. 5References

4.4 Connectors and Receptacles

When implementing a through-hole receptacle (like a USB Standard-A), TI recommends making high-speed differential signal connections to the receptacle on the bottom layer of the PCB. Making these connections on the bottom layer of the PCB prevents the through-hole pin from acting as a stub in the transmission path. For surface-mount receptacles such as USB Micro-B and Micro-AB, make high-speed differential signal connections on the top layer. Making these connections on the top layer eliminates the need for vias in the transmission path. For examples of USB through-hole receptacle connections.

Receptacle Stubs Mitigation Figure 4-4 Receptacle Stubs Mitigation
  • A: Signal coming from the middle of the PCB
  • B: Signal coming from the top of the PCB
  • C: Signal coming from the bottom of the PCB