SLLSF22I April   2018  – August 2026 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: Driver
    10. 6.10 Electrical Characteristics: Receiver
    11. 6.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 6.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 6.13 Switching Characteristics: Driver
    14. 6.14 Switching Characteristics: Receiver
    15. 6.15 Insulation Characteristics Curves
    16. 6.16 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 8.3.2 Failsafe Receiver
      3. 8.3.3 Thermal Shutdown
      4. 8.3.4 Glitch-Free Power Up and Power Down
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Data Rate and Bus Length
        2. 9.2.2.2 Stub Length
        3. 9.2.2.3 Bus Loading
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
        1. 10.1.1.1 Related Links
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.9 Electrical Characteristics: Driver

All typical specs are at VCC1=3.3V, VCC2=5V, TA=27°C, (Min/Max specs are over recommended operating conditions unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
|VOD|Driver differential-output voltage magnitudeOpen circuit voltage, unloaded bus,
3V ≤ VCC2 ≤ 5.5V		1.55VCC2V
RL = 60Ω, –7V ≤ VTEST ≤ 12V (see Figure 7-1), 3V ≤ VCC2 ≤ 3.6V, TA<100C1.52.3V
RL = 60Ω, –7V ≤ VTEST ≤ 12V (see Figure 7-1), 3.1V ≤ VCC2 ≤ 3.6V, TA>100C1.52.3
RL = 60Ω, –7V ≤ VTEST ≤ 12V,
4.5V < VCC2 < 5.5V (see Figure 7-1)		2.13.7V
RL = 100Ω (see Figure 7-2), RS-422 load24.2V
RL = 54Ω (see Figure 7-2), RS-485 load, VCC2 = 3V to 3.6V1.52.3V
RL = 54Ω (see Figure 7-2), RS-485 load,
4.5V < VCC2 < 5.5V		2.13.7V
Δ|VOD|Change in differential output voltage between two statesRL = 54Ω or RL = 100Ω, see Figure 7-2–200200mV
VOCCommon-mode output voltageRL = 54Ω or RL = 100Ω, see Figure 7-210.5 × VCC23V
ΔVOC(SS)change in steady-state common-mode output voltage between two statesRL = 54Ω or RL = 100Ω, see Figure 7-2–200200mV
IOSShort-circuit output currentVD = VCC1 or VD = VGND1, VDE = VCC1, VCC2=3.3V ± 10%
–7V ≤ V ≤ 12V, see Figure 7-11		–250250mA
VD = VCC1 or VD = VGND1, VDE = VCC1, VCC2=5V ± 10%
–7V ≤ V ≤ 12V, see Figure 7-11		250mA
IiInput currentVD and VDE = 0V or VD and VDE = VCC1–1010µA
CMTICommon-mode transient immunityVD=VCC1 or GND1, VCC1 = 1.71V to 5.5V, VCM = 1200V, ISO141x, See Figure 7-485100kV/µs
CMTICommon-mode transient immunityVD=VCC1 or GND1, VCC1 = 1.71V to 5.5V, VCM = 1200V, ISO143x, See Figure 7-485100kV/µs
CMTICommon-mode transient immunityVD=VCC1 or GND1, VCC1 = 2.25V to 5.5V, VCM = 1200V, ISO145x, See Figure 7-485100kV/µs