SLLSF22I April   2018  – August 2026 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: Driver
    10. 6.10 Electrical Characteristics: Receiver
    11. 6.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 6.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 6.13 Switching Characteristics: Driver
    14. 6.14 Switching Characteristics: Receiver
    15. 6.15 Insulation Characteristics Curves
    16. 6.16 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 8.3.2 Failsafe Receiver
      3. 8.3.3 Thermal Shutdown
      4. 8.3.4 Glitch-Free Power Up and Power Down
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Data Rate and Bus Length
        2. 9.2.2.2 Stub Length
        3. 9.2.2.3 Bus Loading
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
        1. 10.1.1.1 Related Links
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)(2)
MINMAXUNIT
VCC1Supply voltage, side 1-0.56V
VCC2Supply voltage, side 2-0.56V
VIOLogic voltage level (D, DE, RE, R)-0.5VCC1+0.5(3)V
IOOutput current on R pin-1515mA
VBUSVoltage on bus pins (A, B, Y, Z with respect to GND2)-1818V
TJJunction temperature-40150℃
TSTGStorage temperature-65150℃
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetimeOperation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
(3) Maximum voltage must not exceed 6V