SLLSFB7 March   2026 TLIN1124A-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings - IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Power Supply Characteristics
    7. 5.7 Electrical Characteristics
    8. 5.8 AC Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LIN (Local Interconnect Network) Bus
        1. 7.3.1.1 LIN Transmitter Characteristics
        2. 7.3.1.2 LIN Receiver Characteristics
          1. 7.3.1.2.1 Termination
      2. 7.3.2 TXDx (Transmit Input and Output)
      3. 7.3.3 RXDx (Receive Output)
      4. 7.3.4 VSUP (Supply Voltage)
      5. 7.3.5 VIO (logic interface supply voltage)
      6. 7.3.6 GND (Ground)
      7. 7.3.7 SLP (Sleep Input)
      8. 7.3.8 INHN (Inhibit high voltage output terminal)
      9. 7.3.9 Protection Features
        1. 7.3.9.1 TXD Dominant Time Out (TXD DTO)
        2. 7.3.9.2 LIN Dominant timeout (LIN DTO)
        3. 7.3.9.3 Thermal Shutdown
        4. 7.3.9.4 Under Voltage on VSUP and VIO
        5. 7.3.9.5 Unpowered Device and LIN Bus
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Wake Up Events
        1. 7.4.4.1 Wake Up Request (RXD)
        2. 7.4.4.2 Mode Transitions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

7.3.9.3 Thermal Shutdown

The device is protected by limiting the on-chip power dissipation in fault scenarios. If the junction temperature, TJ , of the device exceeds the thermal shutdown threshold rising threshold TSDR, the device will react depending on the current state (see below). Once the over temperature fault condition has been removed and the junction temperature has cooled beyond the hysteresis temperature, device transitions to the previous state before thermal shutdown (TSD) had occurred.

Normal Mode

During a TSD event, the control logic puts all the LINx transmitters into the recessive state and the commander termination RCOMMANDER is switched off for all channels. INHN is kept at the same logic as before entering TSD, while TXDx, SLP pins are ignored.

Standby Mode

During a TSD event, the control logic puts all the LINx transmitters into the recessive state and the commander termination RCOMMANDER is switched off for all channels. INHN is kept same at the logic as before entering TSD, while TXDx, SLP pins are ignored. Received wakeup events are cleared while in over temperature state (RXDx is made high).

Sleep Mode

In sleep mode, the over temperature monitor is turned off for power savings.