SLLSFB7 March   2026 TLIN1124A-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings - IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Power Supply Characteristics
    7. 5.7 Electrical Characteristics
    8. 5.8 AC Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LIN (Local Interconnect Network) Bus
        1. 7.3.1.1 LIN Transmitter Characteristics
        2. 7.3.1.2 LIN Receiver Characteristics
          1. 7.3.1.2.1 Termination
      2. 7.3.2 TXDx (Transmit Input and Output)
      3. 7.3.3 RXDx (Receive Output)
      4. 7.3.4 VSUP (Supply Voltage)
      5. 7.3.5 VIO (logic interface supply voltage)
      6. 7.3.6 GND (Ground)
      7. 7.3.7 SLP (Sleep Input)
      8. 7.3.8 INHN (Inhibit high voltage output terminal)
      9. 7.3.9 Protection Features
        1. 7.3.9.1 TXD Dominant Time Out (TXD DTO)
        2. 7.3.9.2 LIN Dominant timeout (LIN DTO)
        3. 7.3.9.3 Thermal Shutdown
        4. 7.3.9.4 Under Voltage on VSUP and VIO
        5. 7.3.9.5 Unpowered Device and LIN Bus
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Wake Up Events
        1. 7.4.4.1 Wake Up Request (RXD)
        2. 7.4.4.2 Mode Transitions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

5.4 Recommended Operating Conditions

parameters valid across -40℃ ≤ TJ ≤ 150℃ (unless otherwise noted)
MIN NOM MAX UNIT
VSUP Supply Voltage 5 28 V
VIO Logic interface supply voltage 2.97 5.5 V
VLIN LIN Bus input voltage 0 28 V
VLOGIC Logic Pin Voltage (TXDx, RXDx, SLP) 0 VIO V
IOH(DO) Digital output (RXDx) high level current, VIO = 3V to 3.6V, 4.5V to 5.5V –4 mA
IOL(DO) Digital output (RXDx) low level current, VIO = 3V to 3.6V, 4.5V to 5.5V 4 mA
IO(INHN) Inhibit pin input current 2 mA
TJ Operating virtual junction temperature range -40 150 °C
TSDR Thermal shutdown rising 160 °C
TSDF Thermal shutdown falling 140 °C
TSD(HYS) Thermal shutdown hysteresis 25 °C