SLLSFF7B May   2021  – August 2026 ISOW1044

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Supply Current Characteristics
    11. 6.11 Switching Characteristics
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Power Isolation
    3. 8.3 Signal Isolation
    4. 8.4 CAN Transceiver
    5. 8.5 Remote Wake Request Using Wake-Up Pattern (WUP) in Standby Mode
    6. 8.6 Functional Block Diagram
    7. 8.7 Feature Description
      1. 8.7.1 CAN Bus States
      2. 8.7.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 8.7.3 TXD Dominant Timeout (DTO)
      4. 8.7.4 Power-Up and Power-Down Behavior
      5. 8.7.5 Protection Features
      6. 8.7.6 Floating Pins, Unpowered Device
      7. 8.7.7 Glitch-Free Power Up and Power Down
    8. 8.8 Device Functional Modes
    9. 8.9 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

2 Applications

Device Information
DEVICE PACKAGE(1) PACKAGE SIZE(2) BODY SIZE (NOM)
ISOW1044 DFM (SOIC, 20) 12.83mm × 10.30mm 12.83mm × 7.5mm
ISOW1044B
(2) The package size (length × width) is a nominal value and includes pins, where applicable.