SLLSFS2 September   2025 TCAN6062-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configurations and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings, IEC Transients
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Characteristics
    6. 5.6 Supply Characteristics
    7. 5.7 Dissipation Ratings
    8. 5.8 Electrical Characteristics
    9. 5.9 Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Signal Improvement Capability
      2. 7.1.2 CAN XL and FAST Mode
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO (only for TCAN6062V-Q1)
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 STB (Standby)
      2. 7.3.2  CAN Bus States
      3. 7.3.3  Pulse-Width Modulation (PWM) for FAST Mode Signaling
        1. 7.3.3.1 PWM Detection and Timing
        2. 7.3.3.2 Transition from SIC Mode to FAST RX Mode
        3. 7.3.3.3 Transition from SIC Mode to FAST TX Mode
        4. 7.3.3.4 PWM Decoding
          1. 7.3.3.4.1 PWM Detection Resolution tDECODE
          2. 7.3.3.4.2 PWM Decoding in FAST RX Mode
          3. 7.3.3.4.3 PWM Decoding in FAST TX Mode
        5. 7.3.3.5 Transition from FAST RX/TX Modes to SIC Mode
      4. 7.3.4  Out-of-Bounds (OOB) Comparator
      5. 7.3.5  TXD Dominant Timeout (DTO)
      6. 7.3.6  CAN Bus short-circuit current limiting
      7. 7.3.7  Thermal Shutdown (TSD)
      8. 7.3.8  Undervoltage Lockout
      9. 7.3.9  Unpowered Device
      10. 7.3.10 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Standby Mode
        1. 7.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 7.4.4 Driver and Receiver Function
  9. Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
        1. 8.1.1.1 CAN Termination
      2. 8.1.2 Detailed Design Procedures
        1. 8.1.2.1 Bus Loading, Length and Number of Nodes
    2. 8.2 System Examples
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Signal Improvement Capability

Signal Improvement Capability (SIC) is an additional feature added to the transceiver that enhances the maximum data rate achievable in complex star topologies by minimizing signal ringing. Signal ringing is the result of reflections caused by impedance mismatch at various points in a CAN network due to the nodes that act as stubs.

An example of a complex network is shown in Figure 7-1.

TCAN6062-Q1 TCAN6062V-Q1 CAN Network: Star topologyFigure 7-1 CAN Network: Star topology

The recessive-to-dominant signal edge is usually clean and is strongly driven by the transmitter. Transmitter output impedance of CAN transceiver is approximately 50Ω and matches to the network characteristic impedance. For a regular CAN FD transceiver, dominant-to-recessive edge is when the driver output impedance goes to approximately 60kΩ and signal reflected back experiences impedance mismatch which causes ringing. TCAN6062-Q1 resolves this issue by using TX-based SIC when in SIC mode. The TCAN6062-Q1 continues to drive the bus recessive until tACT_REC_end, so the reflections die down and the recessive bit is clean at sampling point. In the active recessive phase, transmitter output impedance is low (approximately 100Ω). After this phase is over and device goes to passive recessive phase, driver output impedance goes to high-Z. This phenomenon is explained with Figure 7-2.

For more information on the TI signal improvement technology and the compares with similar devices in market, please refer to the white paper How Signal Improvement Capability Unlocks the Real Potential of CAN-FD Transceivers.

TCAN6062-Q1 TCAN6062V-Q1 TX based SICFigure 7-2 TX based SIC