SLLSFS2 September   2025 TCAN6062-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configurations and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings, IEC Transients
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Characteristics
    6. 5.6 Supply Characteristics
    7. 5.7 Dissipation Ratings
    8. 5.8 Electrical Characteristics
    9. 5.9 Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Signal Improvement Capability
      2. 7.1.2 CAN XL and FAST Mode
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO (only for TCAN6062V-Q1)
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 STB (Standby)
      2. 7.3.2  CAN Bus States
      3. 7.3.3  Pulse-Width Modulation (PWM) for FAST Mode Signaling
        1. 7.3.3.1 PWM Detection and Timing
        2. 7.3.3.2 Transition from SIC Mode to FAST RX Mode
        3. 7.3.3.3 Transition from SIC Mode to FAST TX Mode
        4. 7.3.3.4 PWM Decoding
          1. 7.3.3.4.1 PWM Detection Resolution tDECODE
          2. 7.3.3.4.2 PWM Decoding in FAST RX Mode
          3. 7.3.3.4.3 PWM Decoding in FAST TX Mode
        5. 7.3.3.5 Transition from FAST RX/TX Modes to SIC Mode
      4. 7.3.4  Out-of-Bounds (OOB) Comparator
      5. 7.3.5  TXD Dominant Timeout (DTO)
      6. 7.3.6  CAN Bus short-circuit current limiting
      7. 7.3.7  Thermal Shutdown (TSD)
      8. 7.3.8  Undervoltage Lockout
      9. 7.3.9  Unpowered Device
      10. 7.3.10 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Standby Mode
        1. 7.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 7.4.4 Driver and Receiver Function
  9. Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
        1. 8.1.1.1 CAN Termination
      2. 8.1.2 Detailed Design Procedures
        1. 8.1.2.1 Bus Loading, Length and Number of Nodes
    2. 8.2 System Examples
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Supply Characteristics

parameters valid over recommended operating conditions with -40℃ ≤ TJ ≤ 150℃ (Typical values are at VCC = 5 V, VIO = 3.3 V, Device ambient maintained at 27℃ unless otherwise noted) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Supply current SIC mode

 
Dominant TXD = 0 V, STB = 0 V
RL = 60 Ω, CL = open
57 75 mA
Dominant TXD = 0 V, STB = 0 V
RL = 50 Ω, CL = open
61 80 mA
Recessive TXD = VIO, STB = 0 V
RL = 50 Ω, CL = open
13 18 mA
Dominant with bus fault TXD = 0 V, STB = 0 V
CANH = CANL = ±25 V
RL = open, CL = open
135 mA
ICC Supply current Fast TX mode

 
Level_0 or Level_1 TXD = PWM symbol, STB = 0 V, RL = 45 Ω 45 60 mA
TXD = PWM symbol, STB = 0 V, RL = 50 Ω 45 60 mA
ICC Supply current Fast RX mode

 
Fast-RX Mode TXD = PWM symbol, STB = 0 V, CRXD = 15 pF 12 19 mA
ICC Supply current standby mode (devices with VIO )

 
TXD = STB = VIO, RL = 50 Ω, CL = open,  Tj <= 85 °C 1 µA
TXD = STB = VIO, RL = 50 Ω, CL = open, Tj <= 125 °C 0.2 2
TXD = STB = VIO, RL = 50 Ω, CL = open, Tj <= 150 °C 5
ICC Supply current standby mode (devices without VIO )

 
TXD = STB = VCC, RL = 50 Ω, CL = open, Tj <= 85 °C 13.5 µA
TXD = STB = VCC, RL = 50 Ω, CL = open, Tj <= 125 °C 15
TXD = STB = VCC, RL = 50 Ω, CL = open, Tj <= 150 °C 16
IIO I/O supply current SIC mode
Devices with VIO

 
Dominant TXD = 0 V, STB = 0 V
RL = 50 Ω, CL = open
RXD floating
125 170 µA
Recessive TXD = VIO, STB = 0 V
RL = 50 Ω, CL = open
RXD floating
25 80 µA
IIO I/O supply current standby mode
Devices with VIO

 
TXD = VIO, STB = VIO
RL = 50 Ω, CL = open
RXD floating, Tj <= 85 °C
13.5 µA
TXD = VIO, STB = VIO
RL = 50 Ω, CL = open
RXD floating, Tj <= 125 °C
8.5 15
TXD = VIO, STB = VIO
RL = 50 Ω, CL = open
RXD floating, Tj <= 150 °C
16
UVCC(R) Undervoltage detection VCC rising Ramp up 4.2 4.4 V
UVCC(F) Undervoltage detection on VCC falling Ramp down 3.5 4 V
UVVCC(HYS) Hysteresis voltage for VCC undervoltage lockout 200 mV
UVIO(R) Undervoltage detection VIO rising (Devices with VIO) Ramp up 1.6 1.65 V
UVIO(F) Undervoltage detection on VIO falling (Devices with VIO) Ramp down 1.4 1.5 V
UVVIO(HYS) Hysteresis voltage for VIO undervoltage lockout 45 mV