SLLSFS2 September   2025 TCAN6062-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings, IEC Transients
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Characteristics
    6. 5.6 Supply Characteristics
    7. 5.7 Dissipation Ratings
    8. 5.8 Electrical Characteristics
    9. 5.9 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Signal Improvement Capability
      2. 7.1.2 CAN XL and FAST Mode
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO (only for TCAN6062V-Q1)
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 STB (Standby)
      2. 7.3.2  CAN Bus States
      3. 7.3.3  Pulse-Width Modulation (PWM) for FAST Mode Signaling
        1. 7.3.3.1 PWM Detection and Timing
        2. 7.3.3.2 Transition from SIC Mode to FAST RX Mode
        3. 7.3.3.3 Transition from SIC Mode to FAST TX Mode
        4. 7.3.3.4 PWM Decoding
          1. 7.3.3.4.1 PWM Detection Resolution tDECODE
          2. 7.3.3.4.2 PWM Decoding in FAST RX Mode
          3. 7.3.3.4.3 PWM Decoding in FAST TX Mode
        5. 7.3.3.5 Transition from FAST RX/TX Modes to SIC Mode
      4. 7.3.4  Out-of-Bounds (OOB) Comparator
      5. 7.3.5  TXD Dominant Timeout (DTO)
      6. 7.3.6  CAN Bus short-circuit current limiting
      7. 7.3.7  Thermal Shutdown (TSD)
      8. 7.3.8  Undervoltage Lockout
      9. 7.3.9  Unpowered Device
      10. 7.3.10 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Standby Mode
        1. 7.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 7.4.4 Driver and Receiver Function
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
        1. 8.1.1.1 CAN Termination
      2. 8.1.2 Detailed Design Procedures
        1. 8.1.2.1 Bus Loading, Length and Number of Nodes
    2. 8.2 System Examples
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

5.5 Thermal Characteristics

THERMAL METRIC(1) TCAN6062V-Q1 UNIT
D (SOIC) DRB (VSON)
RΘJA Junction-to-ambient thermal resistance 109 ℃/W
RΘJC(top) Junction-to-case (top) thermal resistance 46.4 ℃/W
RΘJB Junction-to-board thermal resistance 56.5 ℃/W
ΨJT Junction-to-top characterization parameter 4.8 ℃/W
ΨJB Junction-to-board characterization parameter 55.6 ℃/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance n/a ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.