SLLSG09 August   2026 TCAN2957-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 IEC ESD Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Supply Characteristics
    7. 6.7 Electrical Characteristics
    8. 6.8 Timing Requirements
    9. 6.9 Switching Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VCC1 Regulator
      2. 8.3.2  VCC2 Regulator
      3. 8.3.3  VEXCC Regulator
        1. 8.3.3.1 VEXCC in Stand-alone Configuration
        2. 8.3.3.2 VEXCC in Load-Sharing Conguration with VCC1
          1. 8.3.3.2.1 VEXCC: Unused Pins Configuration
      4. 8.3.4  CAN FD Transceiver
        1. 8.3.4.1 Driver and Receiver Function
        2. 8.3.4.2 CAN Bus Biasing
      5. 8.3.5  LIN Transceiver
        1. 8.3.5.1 LIN Transmitter Characteristics
        2. 8.3.5.2 LIN Receiver Characteristics
        3. 8.3.5.3 LIN Termination
      6. 8.3.6  High-Side Switches
      7. 8.3.7  WAKE and Voltage Monitoring Input
        1. 8.3.7.1 WAKE Pins Alternate Configurations
          1. 8.3.7.1.1 VBAT monitoring
          2. 8.3.7.1.2 Direct Drive
          3. 8.3.7.1.3 Using Wake Pins For Hardware ID Function
      8. 8.3.8  nRST Pin
      9. 8.3.9  LIMP Output
      10. 8.3.10 Interrupt Function
      11. 8.3.11 SW Pin
      12. 8.3.12 GFO Pin
      13. 8.3.13 Wake Features
        1. 8.3.13.1 CAN Bus Wake via CRXD Request (BWRR) in Sleep Mode
        2. 8.3.13.2 LIN Bus Wake
        3. 8.3.13.3 Local Wake Up (LWU) via WAKEx Input Terminal
          1. 8.3.13.3.1 Static Wake
          2. 8.3.13.3.2 Cyclic Sensing Wake
        4. 8.3.13.4 Cyclic Wake
        5. 8.3.13.5 Direct Drive in Sleep Mode
      14. 8.3.14 Long Duration Timer
      15. 8.3.15 Safety Features
        1. 8.3.15.1  Watchdog
          1. 8.3.15.1.1 Watchdog Error Counter and Action
          2. 8.3.15.1.2 Watchdog SPI Programming
            1. 8.3.15.1.2.1 Watchdog Configuration Registers Lock and Unlock
          3. 8.3.15.1.3 Watchdog Timing
          4. 8.3.15.1.4 Question and Answer Watchdog
            1. 8.3.15.1.4.1 WD Question and Answer Basic Information
            2. 8.3.15.1.4.2 Question and Answer Register and Settings
            3. 8.3.15.1.4.3 WD Question and Answer Value Generation
              1. 8.3.15.1.4.3.1 Answer Comparison
              2. 8.3.15.1.4.3.2 Sequence of the 2-bit Watchdog Answer Counter
            4. 8.3.15.1.4.4 Question and Answer WD Example
              1. 8.3.15.1.4.4.1 Example Configuration for Desired Behavior
              2. 8.3.15.1.4.4.2 Example of Performing a Question and Answer Sequence
        2. 8.3.15.2  Under/Over Voltage Lockout and Unpowered Device
          1. 8.3.15.2.1 Under-voltage
            1. 8.3.15.2.1.1 VSUP and VHSS Under-voltage
            2. 8.3.15.2.1.2 VCC1 Under-voltage
            3. 8.3.15.2.1.3 VCC2 and VEXCC Under-voltage
            4. 8.3.15.2.1.4 VCAN Under-voltage
          2. 8.3.15.2.2 VCC1, VCC2 and VEXCC Over-voltage
          3. 8.3.15.2.3 VCC1, VCC2 and VEXCC Short Circuit
        3. 8.3.15.3  Analog Built-in Self Test (ABIST)
        4. 8.3.15.4  Clock Monitoring
        5. 8.3.15.5  Bandgap Cross-Monitoring
        6. 8.3.15.6  Device Reset
        7. 8.3.15.7  Floating Terminals
        8. 8.3.15.8  LIN Bus Stuck Dominant System Fault: False Wake Up Lockout
        9. 8.3.15.9  Thermal Shutdown
        10. 8.3.15.10 Bus Fault Detection and Communication
      16. 8.3.16 SPI Communication
        1. 8.3.16.1 Cyclic Redundancy Check
        2. 8.3.16.2 Chip Select Not (nCS):
        3. 8.3.16.3 SPI Clock Input (SCK):
        4. 8.3.16.4 SPI Data Input (SDI):
        5. 8.3.16.5 SPI Data Output (SDO):
    4. 8.4 Device Functional Modes
      1. 8.4.1 Init Mode
      2. 8.4.2 Normal Mode
      3. 8.4.3 Standby Mode
      4. 8.4.4 Restart Mode
      5. 8.4.5 Fail-safe Mode
      6. 8.4.6 Sleep Mode
  10. 9 Device Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Normal Mode Application Note
        2. 10.2.1.2 Standby Mode Application Note
        3. 10.2.1.3 LTXD Dominant State Timeout Application Note
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Detailed Design Procedure
        2. 10.2.2.2 LIN Detailed Design Procedures
      3. 10.2.3 Device Brownout information
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 CAN Transceiver Physical Layer Standards:
      2. 11.1.2 LIN Transceiver Physical Layer Standards
      3. 11.1.3 EMC Requirements:
      4. 11.1.4 Conformance Test Requirements:
      5. 11.1.5 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information
    2. 13.2 Mechanical Data

5 Pin Configuration and Functions

TCAN2945-Q1 TCAN2947-Q1 TCAN2955-Q1 TCAN2957-Q1 RHB Package, 32 Pin (QFN) Top ViewFigure 5-1 RHB Package, 32 Pin (QFN)
Top View
Table 5-1 Pin Functions RHB Package
PINTYPEDESCRIPTION
NO.

TCAN2945

TCAN2955

TCAN2947

TCAN2957
1WAKE2WAKE2high voltageLocal wake input terminal, high voltage capable
2WAKE1WAKE1high voltageLocal wake input terminal, high voltage capable
3LIMPLIMPhigh voltageLimp home output (Active low; open-drain output)
4HSS4/ WAKE4HSS4/ WAKE4high voltageCan be configured as either High side switch 4 or WAKE4
5HSS3HSS3high voltageHigh side switch
6HSS2HSS2high voltageHigh side switch
7HSS1HSS1high voltageHigh side switch
8VHSSVHSSpowerHigh side switch power
9VSUPVSUPhigh voltage powerHigh voltage supply from the battery
10VEXMONVEXMONpowerExternal PNP emitter connection, shunt connection
11VEXCTRLVEXCTRLpowerExternal PNP base control
12VEXCCVEXCCpowerExternal PNP collector connection feedback
13VCC1VCC1powerLDO supply output: 3.3V or 5V
14nRSTnRSTdigitalVCC output monitor pin (active low) and device reset input
15nINTnINTdigitalInterrupt output (active low)
16SWSWdigitalProgramming mode input pin (SPI configurable active high or active low)
17SCKSCKdigitalSPI clock input
18SDISDIdigitalSPI data input
19SDOSDOdigitalSPI data output
20nCSnCSdigitalChip select input (active low)
21NULTXDdigitalLIN transmit data input (low for dominant and high for recessive bus states)
NU is not used and should not be connected to anything
22NULRXDdigitalLIN receive data output (low for dominant and high for recessive bus states)
NU is not used and should not be connected to anything
23CTXDCTXDdigitalCAN transmit data input (low for dominant and high for recessive bus states)
24CRXDCRXDdigitalCAN receive data output (low for dominant and high for recessive bus states)
25GFOGFOdigitalFunction output pin (SPI configurable)
26VCC2VCC2power5V LDO output
27VCANVCANpowerCAN FD transceiver 5V power supply input
28CANHCANHbus I/OHigh level CAN bus I/O line
29 CANLCANLbus I/OLow level CAN bus I/O line
30GNDGNDpowerGround connection: Must be soldered to ground
31NULINhigh voltage I/OLIN bus input/output pin:
NU is not used and should not be connected to anything
32 WAKE3/DIRWAKE3/DIRhigh voltageLocal wake input terminal, high voltage capable.

Direct drive to control any HSSx when configured

PAD(1)GNDGNDpowerGround connection: Must be soldered to ground
(1) The thermal pad, PAD, is a device ground pin must be soldered to GND