SLOS081O February   1977  – September 2025 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL082M , TL084 , TL084A , TL084B , TL084H , TL084M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics: TL08xH
    8. 5.8  Electrical Characteristics (DC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    9. 5.9  Electrical Characteristics (AC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    10. 5.10 Typical Characteristics: TL08xH
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

9.1.1 Device Nomenclature

Table 9-1 Device Nomenclature
PART NUMBER DEFINITION
TL08xyzzzzzz x is the channel count
If y = H, the die is manufactured on the latest flow (CSO: RFB).

Section 5.7 and Section 5.10 describe the performance of the new die.
If y ≠ H and y ≠ M, the die is manufactured on the legacy flow (CSO: SFAB) or the latest flow (CSO: RFB).

Section 5.8 and Section 5.9 describe the performance of the original die.
If y = M, the device is specified for the extended temperature range of –55°C to +125°C. The die is manufactured on the legacy flow (CSO:SFAB).

The letters and numbers represented by z are grade-out and package options described in Section 5.8 and the Package Option Addendum at the end of this data sheet.