SLOS081O February   1977  – September 2025 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL082M , TL084 , TL084A , TL084B , TL084H , TL084M

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics: TL08xH
    8. 5.8  Electrical Characteristics (DC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    9. 5.9  Electrical Characteristics (AC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    10. 5.10 Typical Characteristics: TL08xH
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision N (June 2024) to Revision O (September 2025)

  • Changed Vn = 18nV/√Hz to Vn = 37nV/√Hz in Features Go
  • Updated Device Information tableGo
  • Changed TL081 to TL081 SOIC only in figure1 and TL081 (Each Amplifier) in figure2 of Logic Symbols Go
  • Updated pin name from V– to VCC– and V+ to VCC+ in Figure 4-1 and Figure 4-2Go
  • Updated caption for Figure 4-3Go
  • Updated caption for Figure 4-4Go
  • Changed TL081x to TL081C in Table 4-2Go
  • Updated HBM value from 2000V to 1500VGo
  • Deleted plots for THD+N Ratio vs Frequency, THD+N vs Output Amplitude, and CMRR and PSRR vs Frequency Go
  • Added "(for SO Package Only)" to Figure 6-4, Test Figure 4 Go
  • Deleted System Examples sectionGo
  • Updated 2nd bullet in Layout Guidelines Go
  • Added Device Nomenclature tableGo

Changes from Revision M (December 2021) to Revision N (June 2024)

  • Changed Absolute Maximum Ratings, ESD Ratings, Recommended Operating Conditions, and Thermal Information sections by merging TL08xH and TL08xx specificationsGo
  • Changed Electrical Characteristics tables by merging TL08xC, TL08xAC, TL08xBC, TL08xI, and TL08xM specificationsGo
  • Increased gain bandwidth of all non-NS/non-PS packages and non-TL08xM devices from 3 MHz to 5.25 MHzGo
  • Merged TL08xC, TL08xAC, TL08xBC, TL08xI, and TL08xM Switching Characteristics tables and renamed to Electrical Characteristics (AC)Go
  • Changed input voltage noise density at 1 kHz for all non-PS/non-NS packages and all non-TL08xM devices to 37 nV/√HzGo
  • Changed THD+N for all non-PS/non-NS packages and all non-TL08xM devices to 0.00012%Go
  • Updated Functional Block Diagram and Feature Description sectionsGo

Changes from Revision L (July 2021) to Revision M (December 2021)

  • Corrected DCK pinout diagram and table in Pin Configurations and Functions sectionGo