10 Revision History
Changes from Revision N (June 2024) to Revision O (September 2025)
- Changed Vn = 18nV/√Hz to Vn = 37nV/√Hz in
Features
Go
- Updated Device Information tableGo
- Changed TL081 to TL081 SOIC only in figure1 and TL081 (Each Amplifier) in
figure2 of Logic Symbols
Go
- Updated pin name from V– to VCC– and V+ to VCC+ in Figure 4-1 and
Figure 4-2Go
- Updated caption for Figure 4-3Go
- Updated caption for Figure 4-4Go
- Changed TL081x to TL081C in Table 4-2Go
- Updated HBM value from 2000V to 1500VGo
- Deleted plots for THD+N Ratio vs Frequency, THD+N vs Output
Amplitude, and CMRR and PSRR vs Frequency
Go
- Added "(for SO Package Only)" to Figure 6-4, Test Figure
4
Go
- Deleted System Examples sectionGo
- Updated 2nd bullet in Layout Guidelines
Go
- Added Device Nomenclature tableGo
Changes from Revision M (December 2021) to Revision N (June 2024)
- Changed Absolute Maximum Ratings, ESD Ratings, Recommended Operating Conditions, and Thermal Information sections by merging TL08xH and TL08xx specificationsGo
- Changed Electrical Characteristics tables by merging TL08xC, TL08xAC, TL08xBC, TL08xI, and TL08xM specificationsGo
- Increased gain bandwidth of all non-NS/non-PS packages and non-TL08xM devices from 3 MHz to 5.25 MHzGo
- Merged TL08xC, TL08xAC, TL08xBC, TL08xI, and TL08xM Switching Characteristics tables and renamed to Electrical Characteristics (AC)Go
- Changed input voltage noise density at 1 kHz for all non-PS/non-NS packages and all non-TL08xM devices to 37 nV/√HzGo
- Changed THD+N for all non-PS/non-NS packages and all non-TL08xM devices to 0.00012%Go
- Updated Functional Block Diagram and Feature Description
sectionsGo
Changes from Revision L (July 2021) to Revision M (December 2021)
- Corrected DCK pinout diagram and table in Pin Configurations and
Functions sectionGo