SLUS900F December   2008  – August 2026 BQ32000

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings #GUID-4430518C-46E5-4467-8224-12E6F82A6B20/AMR001
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 IRQ Function
      2. 6.3.2 VBACK Switchover
      3. 6.3.3 Trickle Charge
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
  8. 7 Register Maps
    1. 7.1 I2C Read After Backup Mode
    2. 7.2 Normal Register Descriptions
      1. 7.2.1  SECONDS Register (address = 0x00) [reset = 0XXXXXXb]
      2. 7.2.2  MINUTES Register (address = 0x01) [reset = 1XXXXXXb]
      3. 7.2.3  CENT_HOURS Register (address = 0x02) [reset = XXXXXXXXb]
      4. 7.2.4  DAY Register (address = 0x03) [reset = 00000XXXb]
      5. 7.2.5  DATE Register (address = 0x04) [reset = 00XXXXXXb]
      6. 7.2.6  MONTH Register (address = 0x05) [reset = 000XXXXXb]
      7. 7.2.7  YEARS Register (address = 0x06) [reset = XXXXXXXXb]
      8. 7.2.8  CAL_CFG1 Register (address = 0x07) [reset = 10000000b]
      9. 7.2.9  TCH2 Register (address = 0x08) [reset = 10010000b]
      10. 7.2.10 CFG2 Register (address = 0x09) [reset = 10101010b]
    3. 7.3 Special Function Registers
      1. 7.3.1 SF KEY 1 Register (address = 0x20) [reset = 00000000b]
      2. 7.3.2 SF KEY 2 Register (address = 0x21) [reset = 00000000b]
      3. 7.3.3 SFR Register (address = 0x22) [reset = 00000000b]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Reading From a Register
        2. 8.2.2.2 Leap Year Compensation
        3. 8.2.2.3 Utilizing the Backup Supply
        4. 8.2.2.4 Calibration Example of Crystal Input
        5. 8.2.2.5 Calculating the Super Capacitor Values Example
      3. 8.2.3 Application Curves
    3.     Power Supply Recommendations
    4. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Community Resources
    3. 9.3 Trademarks
  11. 10Revision History
  12.   Mechanical, Packaging, and Orderable Information

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER SUPPLY
ICCVCC supply current100μA
VBACKBackup supply voltageOperating1.4VCCV
Switchover2.0VCC
IBACKBackup supply currentVCC needs a pulse (1), VBACK = 3 V, Oscillator on, TA = 25°C1.21.5μA
LOGIC LEVEL INPUTS
VILInput low voltage0.3 VCCV
VIHInput high voltage0.7 VCCV
IINInput current0 V ≤ VIN ≤ VCC-11μA
LOGIC LEVEL OUTPUTS
VOLOutput low voltageIOL = 3 mA0.4V
ILLeakage current-11μA
REAL-TIME CLOCK CHARACTERISTICS
Pre-calibration accuracyVCC = 3.3 V, VBACK = 3 V, Oscillator on, TA = 25°C±35(2)ppm
(1) The currents measured after issuing a pulse on VCC. The pulse amplitude 0-VCC; pulse width min 1 ms.
(2) Typical accuracy is measured using reference board design and KDS DMX-26S surface-mount 32.768-kHz crystal. Variation in board design and crystal section results in different typical accuracy.