SLVK222 August 2025 TPS7H5020-SP
The TPS7H502X-SP is fabricated in the TI Linear BiCMOS 250-nm process with a back-end-of-line (BEOL) stack consisting of 4 levels of standard thickness aluminum. The total stack height from the surface of the passivation to the silicon surface is 10.9 μm based on nominal layer thickness as shown in Figure 5-1.
Accounting for energy loss through the degrader, copper foil, beam port window, air gap, and the BEOL stack of the TPS7H502X-SP, the effective LET (LETEFF) at the surface of the silicon substrate and the range was determined with:
The results are shown in Ion LETEFF and Range in Silicon.
|
Facility |
Beam Energy (MeV/nucleon) |
Ion Type |
Degrader Steps (#) |
Degrader Angle (°) |
Copper Foil Width (μm) |
Beam Port Window |
Air Gap (mm) |
Angle of Incidence |
LETEFF (MeV·cm2/mg) |
Range in Silicon (μm) |
|---|---|---|---|---|---|---|---|---|---|---|
|
TAMU |
15 |
165Ho |
0 |
0 |
- |
1-mil Aramica |
40 |
0 |
75 |
95.7 |
|
KSEE |
19.5 |
169Tm |
- |
- |
5 |
3-mil PEN |
60 |
0 |
75 |
89.8 |