SLVSDG9C March   2016  – June 2025 TPD1E0B04

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  IEC 61000-4-2 ESD Protection
      2. 6.3.2  IEC 61000-4-4 EFT Protection
      3. 6.3.3  IEC 61000-4-5 Surge Protection
      4. 6.3.4  IO Capacitance
      5. 6.3.5  DC Breakdown Voltage
      6. 6.3.6  Ultra Low Leakage Current
      7. 6.3.7  Low ESD Clamping Voltage
      8. 6.3.8  Supports High Speed Interfaces
      9. 6.3.9  Industrial Temperature Range
      10. 6.3.10 Industry Standard Package
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 USB Type-C Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Signal Range
          2. 7.2.1.2.2 Operating Frequency
        3. 7.2.1.3 Application Curves
      2. 7.2.2 WiFi Antenna Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Signal Range
          2. 7.2.2.2.2 Operating Frequency
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.6 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VRWMReverse stand-off voltageIIO < 10nA–3.63.6V
VBRFBreakdown voltage, IO pin to GNDMeasured as the maximum voltage before device snaps back into VHOLD voltage6.7V
VBRRBreakdown voltage, GND to IO pinMeasured as the maximum voltage before device snaps back into VHOLD voltage–6.7V
VHOLDHolding voltageIIO = 1mA, TA = 25°C55.76.5V
VCLAMPClamping voltageIPP = 1A, TLP, from IO to GND7.2V
IPP = 5A, TLP, from IO to GND10.1
IPP = 16A, TLP, from IO to GND19
IPP = 1A, TLP, from GND to IO7.2
IPP = 5A, TLP, from GND to IO10.1
IPP = 16A, TLP, from GND to IO19
ILEAKLeakage current, IO to GNDVIO = ±2.5V10nA
RDYNDynamic resistanceIO to GND1Ω
GND to IO1
CLLine capacitanceDPL PackageVIO = 0V, f = 1MHz, IO to GND, TA = 25°C0.130.15pF
DPY Package0.150.18