SLVSDG9C March   2016  – June 2025 TPD1E0B04

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  IEC 61000-4-2 ESD Protection
      2. 6.3.2  IEC 61000-4-4 EFT Protection
      3. 6.3.3  IEC 61000-4-5 Surge Protection
      4. 6.3.4  IO Capacitance
      5. 6.3.5  DC Breakdown Voltage
      6. 6.3.6  Ultra Low Leakage Current
      7. 6.3.7  Low ESD Clamping Voltage
      8. 6.3.8  Supports High Speed Interfaces
      9. 6.3.9  Industrial Temperature Range
      10. 6.3.10 Industry Standard Package
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 USB Type-C Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Signal Range
          2. 7.2.1.2.2 Operating Frequency
        3. 7.2.1.3 Application Curves
      2. 7.2.2 WiFi Antenna Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Signal Range
          2. 7.2.2.2.2 Operating Frequency
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

6.3.4 IO Capacitance

The capacitance between each I/O pin to ground is 0.13pF (typical) and 0.15pF (maximum). This device supports data rates in excess of 60Gbps.