SLVSDG9C March   2016  – June 2025 TPD1E0B04

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  IEC 61000-4-2 ESD Protection
      2. 6.3.2  IEC 61000-4-4 EFT Protection
      3. 6.3.3  IEC 61000-4-5 Surge Protection
      4. 6.3.4  IO Capacitance
      5. 6.3.5  DC Breakdown Voltage
      6. 6.3.6  Ultra Low Leakage Current
      7. 6.3.7  Low ESD Clamping Voltage
      8. 6.3.8  Supports High Speed Interfaces
      9. 6.3.9  Industrial Temperature Range
      10. 6.3.10 Industry Standard Package
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 USB Type-C Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Signal Range
          2. 7.2.1.2.2 Operating Frequency
        3. 7.2.1.3 Application Curves
      2. 7.2.2 WiFi Antenna Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Signal Range
          2. 7.2.2.2.2 Operating Frequency
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision B (December 2016) to Revision C (June 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated data rate from 20Gbps to 60GbpsGo
  • Updated Interfaces supportedGo

Changes from Revision A (June 2016) to Revision B (December 2016)

  • Added "and 0402 (DPY) packages." to the Description, and package "X1SON (2)" to the Device Information tableGo
  • Changed the DPY Package From: Preview To Production Go
  • Added the DPY (X1SON) package to the Thermal Information tableGo
  • Added DPY values to CL Line capacitance in the Electrical Characteristics table Go
  • Added "(DPL Package)" to the title of Figure 5-6 Go
  • Added Figure 5-7 Go
  • Added curves for the DPY package to Figure 5-10 and Figure 5-11 Go
  • Added curve for the DPY package to Figure 7-4 Go
  • Added curve for the DPY package to Figure 7-6 Go
  • Added curve for the DPY package to Figure 7-8 Go

Changes from Revision * (March 2016) to Revision A (June 2016)

  • Changed device status from Product Preview to Production Data Go