SLVSDG9C March   2016  – June 2025 TPD1E0B04

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  IEC 61000-4-2 ESD Protection
      2. 6.3.2  IEC 61000-4-4 EFT Protection
      3. 6.3.3  IEC 61000-4-5 Surge Protection
      4. 6.3.4  IO Capacitance
      5. 6.3.5  DC Breakdown Voltage
      6. 6.3.6  Ultra Low Leakage Current
      7. 6.3.7  Low ESD Clamping Voltage
      8. 6.3.8  Supports High Speed Interfaces
      9. 6.3.9  Industrial Temperature Range
      10. 6.3.10 Industry Standard Package
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 USB Type-C Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Signal Range
          2. 7.2.1.2.2 Operating Frequency
        3. 7.2.1.3 Application Curves
      2. 7.2.2 WiFi Antenna Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Signal Range
          2. 7.2.2.2.2 Operating Frequency
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.7 Typical Characteristics

TPD1E0B04 Positive TLP Curve
Figure 5-1 Positive TLP Curve
TPD1E0B04 8kV IEC Waveform
Figure 5-3 8kV IEC Waveform
TPD1E0B04 Surge Curve (tp = 8/20µs), IO Pin to GND
Figure 5-5 Surge Curve (tp = 8/20µs), IO Pin to GND
TPD1E0B04 Capacitance vs Bias Voltage (DPY Package)
Figure 5-7 Capacitance vs Bias Voltage (DPY Package)
TPD1E0B04 DC Voltage Sweep I-V Curve
Figure 5-9 DC Voltage Sweep I-V Curve
TPD1E0B04 Insertion Loss
Figure 5-11 Insertion Loss
TPD1E0B04 Negative TLP Curve
Figure 5-2 Negative TLP Curve
TPD1E0B04 –8kV IEC Waveform
Figure 5-4 –8kV IEC Waveform
TPD1E0B04 Capacitance vs Bias Voltage (DPL Package)
Figure 5-6 Capacitance vs Bias Voltage (DPL Package)
TPD1E0B04 Leakage Current vs Temperature
Figure 5-8 Leakage Current vs Temperature
TPD1E0B04 Capacitance vs Frequency
Figure 5-10 Capacitance vs Frequency
TPD1E0B04 USB3.1 Gen 2 10Gbps Eye Diagram (Bare Board)
Figure 5-12 USB3.1 Gen 2 10Gbps Eye Diagram (Bare Board)
TPD1E0B04 USB3.1 Gen 2 10Gbps Eye Diagram (with TPD1E0B04DPL)
Figure 5-13 USB3.1 Gen 2 10Gbps Eye Diagram (with TPD1E0B04DPL)