SLVSHD9A March   2025  – December 2025 DRV8001-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Auto
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information RHA package
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 External Components
    4. 7.4 Feature Description
      1. 7.4.1 Heater MOSFET Driver
        1. 7.4.1.1 Heater MOSFET Driver Control
        2. 7.4.1.2 Heater MOSFET Driver Protection
          1. 7.4.1.2.1 Heater SH_HS Internal Diode
          2. 7.4.1.2.2 Heater MOSFET VDS Overcurrent Protection (HEAT_VDS)
          3. 7.4.1.2.3 Heater MOSFET Open Load Detection
      2. 7.4.2 High-Side Drivers
        1. 7.4.2.1 High-side Driver Control
          1. 7.4.2.1.1 High-side Driver PWM Generator
          2. 7.4.2.1.2 Constant Current Mode
          3. 7.4.2.1.3 OUTx HS ITRIP Behavior
          4. 7.4.2.1.4 High-side Drivers - Parallel Outputs
        2. 7.4.2.2 High-side Driver Protection Circuits
          1. 7.4.2.2.1 High-side Drivers Internal Diode
          2. 7.4.2.2.2 High-side Driver Short-circuit Protection
          3. 7.4.2.2.3 High-side Driver Overcurrent Protection
          4. 7.4.2.2.4 High-side Driver Open Load Detection
      3. 7.4.3 Electrochromic Glass Driver
        1. 7.4.3.1 Electrochromic Driver Control
        2. 7.4.3.2 Electrochromic Driver Protection
      4. 7.4.4 Half-bridge Drivers
        1. 7.4.4.1 Half-bridge Control
        2. 7.4.4.2 OUT1 and OUT2 High-side Driver Mode
        3. 7.4.4.3 Half-bridge Register Control
        4. 7.4.4.4 Half-Bridge ITRIP Regulation
        5. 7.4.4.5 Half-bridge Protection and Diagnostics
          1. 7.4.4.5.1 Half-Bridge Off-State Diagnostics (OLP)
          2. 7.4.4.5.2 Half-bridge Open Load Detection
          3. 7.4.4.5.3 Half-Bridge Overcurrent Protection
      5. 7.4.5 Sense Output (IPROPI)
      6. 7.4.6 Protection Circuits
        1. 7.4.6.1 Fault Reset (CLR_FLT)
        2. 7.4.6.2 DVDD Logic Supply Power on Reset (DVDD_POR)
        3. 7.4.6.3 PVDD Supply Undervoltage Monitor (PVDD_UV)
        4. 7.4.6.4 PVDD Supply Overvoltage Monitor (PVDD_OV)
        5. 7.4.6.5 VCP Charge Pump Undervoltage Lockout (VCP_UV)
        6. 7.4.6.6 Thermal Clusters
        7. 7.4.6.7 Watchdog Timer
        8. 7.4.6.8 Fault Detection and Response Summary Table
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI)
      2. 7.5.2 SPI Format
      3. 7.5.3 Timing Diagrams
  9. 8  DRV8001-Q1 Register Map
    1. 8.1 DRV8000-Q1_STATUS Registers
    2. 8.2 DRV8000-Q1_CNFG Registers
    3. 8.3 DRV8000-Q1_CTRL Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
    3. 9.3 Initialization Setup
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Bulk Capacitance Sizing
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

DRV8001-Q1 VQFN (RHA) 40-Pin Package and Pin Functions Figure 5-1 VQFN (RHA) 40-Pin Package and Pin Functions
Table 5-1 Pin Functions
PIN I/O(1) TYPE DESCRIPTION
NO. NAME
1 OUT4 O Power 440mΩ half-bridge output 4.
2 NC － － No connect.
3 NC － － No connect.
4 PVDD I Power Device driver power supply input. Connect to the bridge power supply. Connect a 0.1μF, PVDD-rated ceramic capacitor and local bulk capacitance greater than or equal to 10μF between PVDD and GND pins.
5 VCP I/O Power Charge pump output. Connect a 1μF, 16V ceramic capacitor between VCP and PVDD pins.
6 PVDD I Power Device driver power supply input. Connect to the bridge power supply. Connect a 0.1μF, PVDD-rated ceramic capacitor and local bulk capacitance greater than or equal to 10μF between PVDD and GND pins.

7

 OUT5 O Power 155mΩ half-bridge output 5.

8

 PGND I/O Ground Device ground. Connect to system ground.

9

 OUT1 O Power 1.54Ω half-bridge output 1.

10

 OUT2 O Power 1.54Ω half-bridge output 2.

11

 PWM2 I Digital PWM input 2 for regulation of half-bridge drivers

12

PWM1

I

Digital

 PWM input 1 for regulation of all drivers except electrochrome.
13 nSCS I Digital Serial chip select. A logic low on this pin enables serial interface communication. Internal pullup resistor.
14 SDI I Digital Serial data input. Data is captured on the falling edge of the SCLK pin. Internal pulldown resistor.
15 SDO O Digital Serial data output. Data is shifted out on the rising edge of the SCLK pin. Push-pull output.
16 SCLK I Digital Serial clock input. Serial data is shifted out and captured on the corresponding rising and falling edge on this pin. Internal pulldown resistor.

17

 IPROPI I/O Analog Sense output is multiplexed from any of driver load current feedback, PVDD voltage feedback, or thermal cluster temperature feedback.

18

 nSLEEP I Analog Device enable pin. Logic low to shutdown the device and enter sleep mode. Internal pulldown resistor.
19 NC － － No connect.
20 NC － － No connect.

21

 DVDD I Power Device logic and digital output power supply input. Recommended to connect a 1.0µF, 6.3V ceramic capacitor between the DVDD and GND pins.
22 NC － － No connect.

23

 DGND I/O Ground Device ground. Connect to system ground.

24

 ECFB I/O Power For EC control, pin is used as voltage monitor input and fast discharge low-side switch. If the EC drive function is not used, connect this pin to GND through 10kΩ resistor.

25

 ECDRV O Analog For EC control, pin controls the gate of external MOSFET for EC voltage regulation
26 SH_HS I Analog Source pin of high-side heater MOSFET and output to heater load. Connect to source of high-side MOSFET.
27 GH_HS O Analog Gate driver output for heater MOSFET. Connect to gate of high-side MOSFET.

28

 NC － － No connect.

29

 NC － － No connect.

30

 NC － － No connect.
31 OUT12 O Power 1.2Ω high-side driver output 12. Connect to low-side load.
32 OUT11 O Power 1.2Ω high-side driver output 11. Configurable as SC protection switch for EC drive. Connect to low-side load.
33 OUT10 O Power 1.2Ω high-side driver output 10. Connect to low-side load.

34

 OUT9 O Power 1.2Ω high-side driver output 9. Connect to low-side load.

35

 OUT8 O Power 1.2Ω high-side driver output 8. Connect to low-side load.

36

 OUT7 O Power High-side driver output with configurable RDSON (400 mΩ/1200 mΩ). Connect to low-side load.

37

 PVDD I Power Device driver power supply input. Connect to the bridge power supply. Connect a 0.1µF, PVDD-rated ceramic capacitor and local bulk capacitance greater than or equal to 10µF between PVDD and GND pins.

38

 OUT6 O Power 185mΩ half-bridge output 6.

39

 PGND I/O Ground Device ground. Connect to system ground.
40 OUT3 O Power 440mΩ half-bridge output 3.
(1) I = Input, O = Output